IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2012-08-27 14:00
3D-Simulation for temperature rise in tissue mimicking phantom with bone
Nobuyuki Endoh, Takenobu Tsuchiya, Yu Sakuma, Shin Tanaka (Kanagawa Univ.) US2012-39
Abstract (in Japanese) (See Japanese page) 
(in English) This paper describes about comparison between experiments and 3D simulations in the tissue mimicking phantom with bone. The size of agar phantom is 90 x 90 x 90mm and with/without mimicking bone. Acoustic and heat constants of phantoms are almost the same as that of soft tissue. Temperature distributions in phantoms are measured by infrared thermometer. The estimated pressure and temperature distributions in phantoms are calculated by FDTD-HCE method. The calculation results agreed well with experimental results within 0.4degrees.
Keyword (in Japanese) (See Japanese page) 
(in English) temperature / phantom / 3D / Simulation / bone / FDTD / infrared camera /  
Reference Info. IEICE Tech. Rep., vol. 112, no. 186, US2012-39, pp. 27-31, Aug. 2012.
Paper # US2012-39 
Date of Issue 2012-08-20 (US) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF US2012-39

Conference Information
Committee US  
Conference Date 2012-08-27 - 2012-08-28 
Place (in Japanese) (See Japanese page) 
Place (in English) Pukyong National University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) General, Underwater Acoustics (Co-Organization:The Marine Acoustics Society of Japan, Youngnam Chapter of The Acoustical Society of Korea) 
Paper Information
Registration To US 
Conference Code 2012-08-US 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) 3D-Simulation for temperature rise in tissue mimicking phantom with bone 
Sub Title (in English)  
Keyword(1) temperature  
Keyword(2) phantom  
Keyword(3) 3D  
Keyword(4) Simulation  
Keyword(5) bone  
Keyword(6) FDTD  
Keyword(7) infrared camera  
1st Author's Name Nobuyuki Endoh  
1st Author's Affiliation Kanagawa University (Kanagawa Univ.)
2nd Author's Name Takenobu Tsuchiya  
2nd Author's Affiliation Kanagawa University (Kanagawa Univ.)
3rd Author's Name Yu Sakuma  
3rd Author's Affiliation Kanagawa University (Kanagawa Univ.)
4th Author's Name Shin Tanaka  
4th Author's Affiliation Kanagawa University (Kanagawa Univ.)
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Date Time 2012-08-27 14:00:00 
Presentation Time 20 
Registration for US 
Paper # IEICE-US2012-39 
Volume (vol) IEICE-112 
Number (no) no.186 
Page pp.27-31 
#Pages IEICE-5 
Date of Issue IEICE-US-2012-08-20 

[Return to Top Page]

[Return to IEICE Web Page]

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan