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Paper Abstract and Keywords
Presentation 2012-06-27 11:30
[Invited Talk] Gate Stack Technologies for Silicon Carbide Power MOS Devices
Takuji Hosoi, Takashi Kirino, Yusuke Uenishi, Daisuke Ikeguchi, Atthawut Chanthaphan (Osaka Univ.), Akitaka Yoshigoe, Yuden Teraoka (JAEA), Shuhei Mitani, Yuki Nakano, Takashi Nakamura (ROHM), Takayoshi Shimura, Heiji Watanabe (Osaka Univ.)
Abstract (in Japanese) (See Japanese page) 
(in English) Silicon carbide (SiC) is a promising material for high-power electronic devices. Although SiO$_2$ dielectric film can be grown on SiC by conventional thermal oxidation, low channel mobility and poor gate oxide reliability are the critical issues for SiC power metal-oxide-semiconductor field-effect transistors (MOSFETs). In this work, we investigated the fundamental aspects of thermally grown SiO$_2$/4H-SiC structures such as an energy band alignment and flatband voltage (VFB) instability. Both electrical characterization and x-ray photoelectron spectroscopy (XPS) study revealed that a conduction band offset ($\Delta$E$_c$) between SiO$_2$ and SiC is extrinsically increased by large amount of negative interface charges. High-temperature hydrogen annealing could effectively passivate interface defects, but at the same time resulted in the reduced $\Delta$E$_c$ at SiO$_2$/SiC interfaces. We also found that intrinsic positive mobile ions exist in as-oxidized SiO$_2$/SiC structures. Post-oxidation annealing in Ar ambient mostly eliminates the mobile ions, but they are generated again by subsequent high-temperature hydrogen annealing despite the improved interface quality. These features were not observed for thermally-grown SiO$_2$/Si structures, and thus considered to be inherent to thermally grown SiO$_2$/SiC structures.
Keyword (in Japanese) (See Japanese page) 
(in English) SiC / thermal oxide / MOS devices / interface defect / mobile ion / / /  
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Conference Information
Committee SDM ED  
Conference Date 2012-06-27 - 2012-06-29 
Place (in Japanese) (See Japanese page) 
Place (in English) Okinawa Seinen-kaikan 
Topics (in Japanese) (See Japanese page) 
Topics (in English) 2012 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices 
Paper Information
Registration To SDM 
Conference Code 2012-06-SDM-ED 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Gate Stack Technologies for Silicon Carbide Power MOS Devices 
Sub Title (in English)  
Keyword(1) SiC  
Keyword(2) thermal oxide  
Keyword(3) MOS devices  
Keyword(4) interface defect  
Keyword(5) mobile ion  
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1st Author's Name Takuji Hosoi  
1st Author's Affiliation Osaka University (Osaka Univ.)
2nd Author's Name Takashi Kirino  
2nd Author's Affiliation Osaka University (Osaka Univ.)
3rd Author's Name Yusuke Uenishi  
3rd Author's Affiliation Osaka University (Osaka Univ.)
4th Author's Name Daisuke Ikeguchi  
4th Author's Affiliation Osaka University (Osaka Univ.)
5th Author's Name Atthawut Chanthaphan  
5th Author's Affiliation Osaka University (Osaka Univ.)
6th Author's Name Akitaka Yoshigoe  
6th Author's Affiliation Japan Atomic Energy Agency (JAEA)
7th Author's Name Yuden Teraoka  
7th Author's Affiliation Japan Atomic Energy Agency (JAEA)
8th Author's Name Shuhei Mitani  
8th Author's Affiliation ROHM Co., Ltd. (ROHM)
9th Author's Name Yuki Nakano  
9th Author's Affiliation ROHM Co., Ltd. (ROHM)
10th Author's Name Takashi Nakamura  
10th Author's Affiliation ROHM Co., Ltd. (ROHM)
11th Author's Name Takayoshi Shimura  
11th Author's Affiliation Osaka University (Osaka Univ.)
12th Author's Name Heiji Watanabe  
12th Author's Affiliation Osaka University (Osaka Univ.)
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Speaker Author-1 
Date Time 2012-06-27 11:30:00 
Presentation Time 30 minutes 
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