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Paper Abstract and Keywords
Presentation 2012-04-20 14:45
Performance of Inter Decoupling by Magnetic Thin Film Noise Suppressor Integrated to LSI Chip
Sho Muroga, Wataru Kodate, Yasushi Endo, Masahiro Yamaguchi (Tohoku Univ.) EMCJ2012-6
Abstract (in Japanese) (See Japanese page) 
(in English) New measurement method for L-coupling on the basis of the IEC standard to evaluate the sheet type ferromagnetic noise suppressor is proposed. Performance of magnetic thin-film is evaluated as a candidate for on-chip noise suppressor. Miniature loops coils implemented on a 90 nm design test element group (TEG) chip are used as the noise transmitter and receiver. Differential transmission parameter Sdd21 is evaluated as a measure of inductive noise intra-decoupling. Magnetic film is useful for frequency selective noise decoupler. The coupling is supported most at the ferromagnetic resonance (FMR) frequency, which is deviated from its intrinsic frequency and the degree of deviation can be calculated by using characteristic length. These results demonstrate that the proposed method is useful to characterize the IC chip level noise suppressor in the GHz range.
Keyword (in Japanese) (See Japanese page) 
(in English) Electoromagnetic Compatibility / Electromagnetic noise suppressor / Intra-decoupling / Demagnetizing field / Ferromagnetic resonance / Inductive-coupling / On-chip measurement /  
Reference Info. IEICE Tech. Rep., vol. 112, no. 12, EMCJ2012-6, pp. 31-36, April 2012.
Paper # EMCJ2012-6 
Date of Issue 2012-04-13 (EMCJ) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
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Conference Information
Committee EMCJ  
Conference Date 2012-04-20 - 2012-04-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Kanazawa Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMCJ 
Conference Code 2012-04-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Performance of Inter Decoupling by Magnetic Thin Film Noise Suppressor Integrated to LSI Chip 
Sub Title (in English)  
Keyword(1) Electoromagnetic Compatibility  
Keyword(2) Electromagnetic noise suppressor  
Keyword(3) Intra-decoupling  
Keyword(4) Demagnetizing field  
Keyword(5) Ferromagnetic resonance  
Keyword(6) Inductive-coupling  
Keyword(7) On-chip measurement  
Keyword(8)  
1st Author's Name Sho Muroga  
1st Author's Affiliation Tohoku University (Tohoku Univ.)
2nd Author's Name Wataru Kodate  
2nd Author's Affiliation Tohoku University (Tohoku Univ.)
3rd Author's Name Yasushi Endo  
3rd Author's Affiliation Tohoku University (Tohoku Univ.)
4th Author's Name Masahiro Yamaguchi  
4th Author's Affiliation Tohoku University (Tohoku Univ.)
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Speaker
Date Time 2012-04-20 14:45:00 
Presentation Time 25 
Registration for EMCJ 
Paper # IEICE-EMCJ2012-6 
Volume (vol) IEICE-112 
Number (no) no.12 
Page pp.31-36 
#Pages IEICE-6 
Date of Issue IEICE-EMCJ-2012-04-13 


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