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Paper Abstract and Keywords
Presentation 2012-01-26 09:55
Measurement of IC Package Inductance with Transmission Line Embedded in Package
Kengo Iokibe, Ayumi Tanimichi, Yoshitaka Toyota (Okayama Univ.) PN2011-35 OPE2011-151 LQE2011-137 EST2011-85 MWP2011-53 Link to ES Tech. Rep. Archives: OPE2011-151 LQE2011-137 EST2011-85 MWP2011-53
Abstract (in Japanese) (See Japanese page) 
(in English) It is of importance for designers to possess accurate inductances of IC packages in power integrity (PI) and electromagnetic compatibility designs.
The authors had proposed a simple method to measure inductance of IC package that is mounted on a practical printed circuit board.
They investigated the method in terms of accuracy here.
In the proposed method, a transmission line is embedded in an IC package interested, and two port $S$ parameters of a network composed of a targeted package structure, the transmission line, and the corresponding symmetric package structure is measured.
The package inductance is calculated from the measured S parameters and properties of the transmission line obtained beforehand.
The proposed method was applied to four test IC packages, and their inductances were measured.
The measurement was demonstrated on a commercial electromagnetic simulator, HFSS.
The package inductances were also obtained by analyzing the test package directly for comparison to the results of the proposed method.
They agreed with the maximum error of 0.9~nH.
To understand a cause of the error, the authors investigated effects of dummy-objects that were used to place measuring ports in the HFSS calculation.
The dummy-object caused errors less than 0.06 nH, which means it seldom cause significant errors.
Keyword (in Japanese) (See Japanese page) 
(in English) IC/LSI / Package / Inductance / Power integrity / Electromagnetic compatibility / Power distribution network / /  
Reference Info. IEICE Tech. Rep., vol. 111, no. 415, EST2011-85, pp. 11-16, Jan. 2012.
Paper # EST2011-85 
Date of Issue 2012-01-19 (PN, OPE, LQE, EST, MWP) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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Download PDF PN2011-35 OPE2011-151 LQE2011-137 EST2011-85 MWP2011-53 Link to ES Tech. Rep. Archives: OPE2011-151 LQE2011-137 EST2011-85 MWP2011-53

Conference Information
Committee EMT PN LQE OPE MWP EST IEE-EMT  
Conference Date 2012-01-26 - 2012-01-27 
Place (in Japanese) (See Japanese page) 
Place (in English) Osaka Univ. Convention Center 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Photonic integrated circuits and devices, swtiching, PLC, fiber devices, waveguide analysis, and others 
Paper Information
Registration To EST 
Conference Code 2012-01-EMT-PN-LQE-OPE-MWP-EST-EMT 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Measurement of IC Package Inductance with Transmission Line Embedded in Package 
Sub Title (in English)  
Keyword(1) IC/LSI  
Keyword(2) Package  
Keyword(3) Inductance  
Keyword(4) Power integrity  
Keyword(5) Electromagnetic compatibility  
Keyword(6) Power distribution network  
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Keyword(8)  
1st Author's Name Kengo Iokibe  
1st Author's Affiliation Okayama University (Okayama Univ.)
2nd Author's Name Ayumi Tanimichi  
2nd Author's Affiliation Okayama University (Okayama Univ.)
3rd Author's Name Yoshitaka Toyota  
3rd Author's Affiliation Okayama University (Okayama Univ.)
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Speaker Author-1 
Date Time 2012-01-26 09:55:00 
Presentation Time 25 minutes 
Registration for EST 
Paper # PN2011-35, OPE2011-151, LQE2011-137, EST2011-85, MWP2011-53 
Volume (vol) vol.111 
Number (no) no.412(PN), no.413(OPE), no.414(LQE), no.415(EST), no.416(MWP) 
Page pp.11-16 
#Pages
Date of Issue 2012-01-19 (PN, OPE, LQE, EST, MWP) 


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