IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2011-12-16 11:45
Honeycomb Substrate Integrated Waveguide (HCSIW) and Its Applications for Design of SIW Components
Hiroaki Ikeuchi, Isao Ohta (Univ. of Hyogo), Mitsuyoshi Kishihara (Okayama Prefectural Univ.), Tadashi Kawai (Univ. of Hyogo) MW2011-137 Link to ES Tech. Rep. Archives: MW2011-137
Abstract (in Japanese) (See Japanese page) 
(in English) This paper treats a new substrate integrated waveguide composed of a honeycomb substrate having a number of small holes (air-filled posts) drilled vertically through the conductor layers of both sides. If the diameter of air posts is sufficiently small in comparison with an operation wavelength and the conductors have a certain thickness, the radiation loss from the small holes can be negligible. In addition, since it can be assumed that the direction of the electric field in the honeycomb substrate is nearly vertical to it, the effective permittivity is approximately derived from the ratio of area occupied by the air-filled posts to the remainder dielectric area. Such a honeycomb substrate integrated waveguide (HCSIW) suffers from the radiation loss from the small holes and the additional conductor loss caused by reduction of conductor area, while the dielectric loss reduces by replacing a part of the lossy dielectric with a lossless air region. First, we calculate the above various losses for a commercial substrate with several conductor thickness. As a result, the attenuation constant of HCSIW is equal to or less than the conventional SIW due to the cancellations of the losses.
Next, we show a design methodology of SIW passive components by arranging the dielectric constant distribution in a circuit by the use of the air-filled posts. As an example, an SIW right-angle corner is dealt with, and a broad-band matching is realized by placing the air-filled posts appropriately to the junction area of the corner. The analysis and design are performed by a commercial HFSS electromagnetic simulator. Moreover, HCSIW can be easily fabricated from a commercial substrate with a PCB prototyping machine.
Keyword (in Japanese) (See Japanese page) 
(in English) Substrate integrated waveguide / Post-wall waveguide / SIW / SIW right-angle corner / Microwave / / /  
Reference Info. IEICE Tech. Rep., vol. 111, no. 351, MW2011-137, pp. 65-70, Dec. 2011.
Paper # MW2011-137 
Date of Issue 2011-12-08 (MW) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF MW2011-137 Link to ES Tech. Rep. Archives: MW2011-137

Conference Information
Committee MW  
Conference Date 2011-12-15 - 2011-12-16 
Place (in Japanese) (See Japanese page) 
Place (in English) Yamaguchi University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Microwave Technologies 
Paper Information
Registration To MW 
Conference Code 2011-12-MW 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Honeycomb Substrate Integrated Waveguide (HCSIW) and Its Applications for Design of SIW Components 
Sub Title (in English)  
Keyword(1) Substrate integrated waveguide  
Keyword(2) Post-wall waveguide  
Keyword(3) SIW  
Keyword(4) SIW right-angle corner  
Keyword(5) Microwave  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Hiroaki Ikeuchi  
1st Author's Affiliation University of Hyogo (Univ. of Hyogo)
2nd Author's Name Isao Ohta  
2nd Author's Affiliation University of Hyogo (Univ. of Hyogo)
3rd Author's Name Mitsuyoshi Kishihara  
3rd Author's Affiliation Okayama Prefectural University (Okayama Prefectural Univ.)
4th Author's Name Tadashi Kawai  
4th Author's Affiliation University of Hyogo (Univ. of Hyogo)
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2011-12-16 11:45:00 
Presentation Time 30 minutes 
Registration for MW 
Paper # MW2011-137 
Volume (vol) vol.111 
Number (no) no.351 
Page pp.65-70 
#Pages
Date of Issue 2011-12-08 (MW) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan