Paper Abstract and Keywords |
Presentation |
2011-11-24 14:30
Design and Evaluation of Bonding Wire Loop Antenna Built into BGA Package on PCB for Short-Range Millimeter Wave Wireless Communication Yukako Tsutsumi, Takayoshi Ito, Shuichi Obayashi, Hiroki Shoki, Hideo Kasami (Toshiba corp.) MW2011-115 Link to ES Tech. Rep. Archives: MW2011-115 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
The 60GHz-band is an unlicensed band in worldwide and expected to be used for the high-speed wireless communications carrying 1Gbps or more. We have investigated a bonding wire loop antenna built into a standard BGA (Ball Grid Array) package for 60 GHz short-range wireless communication. The radiation characteristics of the antenna built into the BGA package vary when it is mounted on the PCB (Print Circuit Board). We describe the design of the metal patterns of the multi-layer PCB to reduce the antenna gain degradation of the built-in bonding wire loop antenna and the measurement results. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
60GHz / millimeter band / short-range wireless communication / antenna in IC package / bonding wire / PCB / / |
Reference Info. |
IEICE Tech. Rep., vol. 111, no. 313, MW2011-115, pp. 9-14, Nov. 2011. |
Paper # |
MW2011-115 |
Date of Issue |
2011-11-17 (MW) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
MW2011-115 Link to ES Tech. Rep. Archives: MW2011-115 |
Conference Information |
Committee |
MW |
Conference Date |
2011-11-24 - 2011-11-25 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
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Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
Microwave Technologies |
Paper Information |
Registration To |
MW |
Conference Code |
2011-11-MW |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Design and Evaluation of Bonding Wire Loop Antenna Built into BGA Package on PCB for Short-Range Millimeter Wave Wireless Communication |
Sub Title (in English) |
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Keyword(1) |
60GHz |
Keyword(2) |
millimeter band |
Keyword(3) |
short-range wireless communication |
Keyword(4) |
antenna in IC package |
Keyword(5) |
bonding wire |
Keyword(6) |
PCB |
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1st Author's Name |
Yukako Tsutsumi |
1st Author's Affiliation |
Toshiba corporation (Toshiba corp.) |
2nd Author's Name |
Takayoshi Ito |
2nd Author's Affiliation |
Toshiba corporation (Toshiba corp.) |
3rd Author's Name |
Shuichi Obayashi |
3rd Author's Affiliation |
Toshiba corporation (Toshiba corp.) |
4th Author's Name |
Hiroki Shoki |
4th Author's Affiliation |
Toshiba corporation (Toshiba corp.) |
5th Author's Name |
Hideo Kasami |
5th Author's Affiliation |
Toshiba corporation (Toshiba corp.) |
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Speaker |
Author-1 |
Date Time |
2011-11-24 14:30:00 |
Presentation Time |
30 minutes |
Registration for |
MW |
Paper # |
MW2011-115 |
Volume (vol) |
vol.111 |
Number (no) |
no.313 |
Page |
pp.9-14 |
#Pages |
6 |
Date of Issue |
2011-11-17 (MW) |