Paper Abstract and Keywords |
Presentation |
2011-11-18 14:10
Temperature Humidity Test of Silver-Epoxy Isotropic Conductive Adhesive Takuya Hirata, Yuichi Aoki (ESPEC CORP.) R2011-35 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
To evaluate the reliability test condition for Isotropic Conductive Adhesive (ICA), we curried out various temperature humidity tests with silver-epoxy ICA and investigated the conductive failure and moisture absorption. The humidity stress caused the oxidization of tin plating at the bonded interface, increasing the electric resistance. The conductive failures are expressed by the equation of relative humidity model of Eyring type, except a HAST condition (110C/85%). Additionally, the characterization of moisture absorption of ICA is also involved in relative humidity. These results indicate that 85C/85% environment is a best condition for accelerating life test of ICA joint. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
ICA / Temperature humidity test / Conductive failure / Acceleration / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 111, no. 304, R2011-35, pp. 13-17, Nov. 2011. |
Paper # |
R2011-35 |
Date of Issue |
2011-11-11 (R) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
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R2011-35 |
Conference Information |
Committee |
R |
Conference Date |
2011-11-18 - 2011-11-18 |
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(See Japanese page) |
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Registration To |
R |
Conference Code |
2011-11-R |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Temperature Humidity Test of Silver-Epoxy Isotropic Conductive Adhesive |
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Keyword(1) |
ICA |
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Temperature humidity test |
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Conductive failure |
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Acceleration |
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1st Author's Name |
Takuya Hirata |
1st Author's Affiliation |
ESPEC CORPORATION (ESPEC CORP.) |
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Yuichi Aoki |
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ESPEC CORPORATION (ESPEC CORP.) |
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Speaker |
Author-1 |
Date Time |
2011-11-18 14:10:00 |
Presentation Time |
25 minutes |
Registration for |
R |
Paper # |
R2011-35 |
Volume (vol) |
vol.111 |
Number (no) |
no.304 |
Page |
pp.13-17 |
#Pages |
5 |
Date of Issue |
2011-11-11 (R) |
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