Paper Abstract and Keywords |
Presentation |
2011-10-12 15:40
Development of Nb multi-layer Advanced Fabrication Process for Large-scale SFQ Circuits Shuichi Nagasawa, Kenji Hinode, Tetsuro Satoh, Mutsuo Hidaka (ISTEC-SRL), Akira Fujimaki, Hiroyuki Akaike (Nagoya Uni.), Nobuyuki Yoshikawa (Yohohama National Uni.), Kazuyoshi Takagi, Naofumi Takagi (Kyoto Uni.) SCE2011-18 Link to ES Tech. Rep. Archives: SCE2011-18 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
We have been developing a Nb multi-layer fabrication process for large-scale SFQ circuits. We have been evaluating both diagnostic chips and shift register chips to improve reliability of the fabrication process. The diagnostic chip was designed to evaluate the characteristics of the basic elements such as junctions, contacts, resisters, and wirings in addition to their defect evaluations. The shift register chip was designed to evaluate defects in real SFQ circuits and defects depending circuit size. We discuss a correlation of defects between the diagnostic chips and the shift register chips, and describe detail of the measurement results of the shift register chips to investigate the many possible causes of the problems and improving reliability in our fabrication process. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
SFQ circuit / Superconducting integrated circuit / Fabrication process / Multi-layer structure / Niobium / Shift register / / |
Reference Info. |
IEICE Tech. Rep., vol. 111, no. 230, SCE2011-18, pp. 37-42, Oct. 2011. |
Paper # |
SCE2011-18 |
Date of Issue |
2011-10-05 (SCE) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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SCE2011-18 Link to ES Tech. Rep. Archives: SCE2011-18 |
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