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Presentation 2011-07-04 13:20
Effect of O2 Annealing for Al2O3/Ge Structure on Interfacial Properties
Shigehisa Shibayama, Kimihiko Kato, Mitsuo Sakashita, Wakana Takeuchi, Osamu Nakatsuka, Shigeaki Zaima (Nagoya Univ.) SDM2011-59 Link to ES Tech. Rep. Archives: SDM2011-59
Abstract (in Japanese) (See Japanese page) 
(in English) For realizing the next generation complementary metal-oxide-semiconductor field-effect-transistors (CMOSFETs), High-k/Ge gate stack structure attracts a high level interest. In particular, it is necessary to achieve both a low interface state density (< 1011 cm-2-eV-1) and a low equivalent oxide thickness (EOT (<1 nm)) for High-k/Ge structure. Al2O3 is a hopeful material as an interfacial layer for High-k/Ge stacks because of a thermal stability and a comparatively high dielectric. However, an Al2O3/Ge structure with a low interface state density has not been realized. Therefore, the decrease in the interface state density of Al2O3/Ge structure is necessary. In this study, we focused on the O2-annealing to Al2O3/Ge structure. As a result, the interface state density of the Al2O3/Ge structure decreased with the O2-annealing. In addition, the O2-annealing causes Ge diffusion into the Al2O3 film and crystallization with a characteristic orientation of the Al2O3 film.
Keyword (in Japanese) (See Japanese page) 
(in English) gate stack structure / Al2O3 / Ge / oxygen annealing / interface state density / / /  
Reference Info. IEICE Tech. Rep., vol. 111, no. 114, SDM2011-59, pp. 51-56, July 2011.
Paper # SDM2011-59 
Date of Issue 2011-06-27 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2011-59 Link to ES Tech. Rep. Archives: SDM2011-59

Conference Information
Committee SDM  
Conference Date 2011-07-04 - 2011-07-04 
Place (in Japanese) (See Japanese page) 
Place (in English) VBL, Nagoya Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Science and Technology for Dielectric Thin Films for Electron Devices 
Paper Information
Registration To SDM 
Conference Code 2011-07-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Effect of O2 Annealing for Al2O3/Ge Structure on Interfacial Properties 
Sub Title (in English)  
Keyword(1) gate stack structure  
Keyword(2) Al2O3  
Keyword(3) Ge  
Keyword(4) oxygen annealing  
Keyword(5) interface state density  
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1st Author's Name Shigehisa Shibayama  
1st Author's Affiliation Nagoya University (Nagoya Univ.)
2nd Author's Name Kimihiko Kato  
2nd Author's Affiliation Nagoya University (Nagoya Univ.)
3rd Author's Name Mitsuo Sakashita  
3rd Author's Affiliation Nagoya University (Nagoya Univ.)
4th Author's Name Wakana Takeuchi  
4th Author's Affiliation Nagoya University (Nagoya Univ.)
5th Author's Name Osamu Nakatsuka  
5th Author's Affiliation Nagoya University (Nagoya Univ.)
6th Author's Name Shigeaki Zaima  
6th Author's Affiliation Nagoya University (Nagoya Univ.)
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Speaker Author-1 
Date Time 2011-07-04 13:20:00 
Presentation Time 20 minutes 
Registration for SDM 
Paper # SDM2011-59 
Volume (vol) vol.111 
Number (no) no.114 
Page pp.51-56 
#Pages
Date of Issue 2011-06-27 (SDM) 


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