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| Presentation | 2011-01-20 14:20 [Invited Talk] CMOS Hyper-Miniaturization and Cooperation with 3D System Design Integration Kazuya Okamoto, Ryohei Satoh (Osaka Univ.) Link to ES Tech. Rep. Archives:  ICD2010-131 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Miniaturization technology based on Dennard’s rule for CMOS devices has been progressing technically over time and has conferred a benefit on the life of mankind. Lithography has made amazing progress so far, achieving high resolution at 32nm-L/S or below using 193nm-UV light. However, there is a low probability that this scenario of producing ever-finer feature geometry will continue, because resolution capabilities will possibly reach a critical limit due to CMOS performance threshold and chip economy. Therefore, to assure continued performance improvements and to create added-value by miniaturization for the future devices, a new 3 dimensional (3D) monolithic integration should acquire increased importance. Especially, precision wafer-to-wafer (W2W) bonding using through-Si-via (TSV) interconnect would be an integral part of this technology. This paper describes key issues of the precision W2W bonding and the inspection methodology to meet higher alignment accuracy. Furthermore, a new system design methodology is described. In conclusion, W2W-3D integration with the new system integrated design will be crucial for the miniaturization-life extension and would be incorporated into the future CMOS devices in a practical manner. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Miniaturization / 3D integration / TSV / Wafer bonding / Inspection / System design integration / / | |
| Reference Info. | IEICE Tech. Rep., vol. 110, no. 380, ICD2010-131, pp. 29-29, Jan. 2011. | |
| Paper # | ICD2010-131 | |
| Date of Issue | 2011-01-13 (ICD) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | Link to ES Tech. Rep. Archives: ICD2010-131 |
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| Conference Information | |
| Committee | ICD IPSJ-ARC |
| Conference Date | 2011-01-20 - 2011-01-21 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Keio University (Hiyoshi Campus) |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | ICD |
| Conference Code | 2011-01-ICD-ARC |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | CMOS Hyper-Miniaturization and Cooperation with 3D System Design Integration |
| Sub Title (in English) | |
| Keyword(1) | Miniaturization |
| Keyword(2) | 3D integration |
| Keyword(3) | TSV |
| Keyword(4) | Wafer bonding |
| Keyword(5) | Inspection |
| Keyword(6) | System design integration |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Kazuya Okamoto |
| 1st Author's Affiliation | Osaka University (Osaka Univ.) |
| 2nd Author's Name | Ryohei Satoh |
| 2nd Author's Affiliation | Osaka University (Osaka Univ.) |
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| Speaker | Author-1 |
| Date Time | 2011-01-20 14:20:00 |
| Presentation Time | 50 minutes |
| Registration for | ICD |
| Paper # | ICD2010-131 |
| Volume (vol) | vol.110 |
| Number (no) | no.380 |
| Page | p.29 |
| #Pages | 1 |
| Date of Issue | 2011-01-13 (ICD) |
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