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Paper Abstract and Keywords
Presentation 2010-11-11 11:00
Failure process and dynamic reliability estimation of sealed relay
Xuerong Ye, Jie Deng, Qiong Yu, Guofu Zhai (Harbin Inst. of Tech.) EMD2010-76 Link to ES Tech. Rep. Archives: EMD2010-76
Abstract (in Japanese) (See Japanese page) 
(in English) Usually the failure rate of a sealed relay is regarded as a constant value, no matter where and how it is used. However, the failure processes of sealed relays won。ッt be the same under different conditions, even for one relay, its failure rate also will be changed during operations. This paper studies the failure process of a kind of sealed relay by analyzing the variations of its time parameters. Among contact resistance and all those time parameters, it is found that closing gap time can indicate the failure process of tested relay very well. For the purpose of verifying this conclusion derived from time parameters, the contacts are observed by microscope after the tested relay failed. Both theoretical calculation result of contacts gap and photos taken by microscope show that the hypothetic failure mode derived from time parameters is reasonable. Based on the failure analysis, the paper also proposes a dynamic reliability estimation method with closing gap time.
Keyword (in Japanese) (See Japanese page) 
(in English) sealed relay / failure process / time parameter / gap time / dynamic reliability estimation / / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 270, EMD2010-76, pp. 41-44, Nov. 2010.
Paper # EMD2010-76 
Date of Issue 2010-11-04 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2010-76 Link to ES Tech. Rep. Archives: EMD2010-76

Conference Information
Committee EMD  
Conference Date 2010-11-11 - 2010-11-12 
Place (in Japanese) (See Japanese page) 
Place (in English) Xi'an Jiaotong University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) IS-EMD2010 (10th International Session in Electro-Mechanical Devices) 
Paper Information
Registration To EMD 
Conference Code 2010-11-EMD 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Failure process and dynamic reliability estimation of sealed relay 
Sub Title (in English)  
Keyword(1) sealed relay  
Keyword(2) failure process  
Keyword(3) time parameter  
Keyword(4) gap time  
Keyword(5) dynamic reliability estimation  
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1st Author's Name Xuerong Ye  
1st Author's Affiliation Harbin Institute of Technology (Harbin Inst. of Tech.)
2nd Author's Name Jie Deng  
2nd Author's Affiliation Harbin Institute of Technology (Harbin Inst. of Tech.)
3rd Author's Name Qiong Yu  
3rd Author's Affiliation Harbin Institute of Technology (Harbin Inst. of Tech.)
4th Author's Name Guofu Zhai  
4th Author's Affiliation Harbin Institute of Technology (Harbin Inst. of Tech.)
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Speaker Author-1 
Date Time 2010-11-11 11:00:00 
Presentation Time 15 minutes 
Registration for EMD 
Paper # EMD2010-76 
Volume (vol) vol.110 
Number (no) no.270 
Page pp.41-44 
#Pages
Date of Issue 2010-11-04 (EMD) 


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