IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2010-07-16 13:00
Comparison of Magnetic Pulse Welding and Resistance Spot Welding for Flat Wires
Tomokatsu Aizawa, Keigo Okagawa (Tokyo Metropolitan College), Yuho Yoshida (Yokodai.JP) EMCJ2010-33 EMD2010-18 Link to ES Tech. Rep. Archives: EMD2010-18
Abstract (in Japanese) (See Japanese page) 
(in English) This paper describes the comparison and experiments of magnetic pulse welding and resistance spot welding for lapped flat wires. When an impulse current passes through a flat one-turn coil, a magnetic flux is suddenly generated around the coil. Eddy currents are induced inside the flat wires near the coil. The wires can be joined both by the Joule heat generated in them and by magnetic pressure. When another impulse current passes through two stick electrodes which sandwiched the flat wires, the wires are joined both by the Joule heating of the impulse current and by pressure from the electrodes.
Keyword (in Japanese) (See Japanese page) 
(in English) Magnetic pulse welding / Spot welding / Flat wire / Micro joining / Joule heating / Magnetic pressure / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 133, EMD2010-18, pp. 7-12, July 2010.
Paper # EMD2010-18 
Date of Issue 2010-07-09 (EMCJ, EMD) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2010-33 EMD2010-18 Link to ES Tech. Rep. Archives: EMD2010-18

Conference Information
Committee EMCJ EMD  
Conference Date 2010-07-16 - 2010-07-16 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Electric discharge, Packaging, EMC, etc. 
Paper Information
Registration To EMD 
Conference Code 2010-07-EMCJ-EMD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Comparison of Magnetic Pulse Welding and Resistance Spot Welding for Flat Wires 
Sub Title (in English)  
Keyword(1) Magnetic pulse welding  
Keyword(2) Spot welding  
Keyword(3) Flat wire  
Keyword(4) Micro joining  
Keyword(5) Joule heating  
Keyword(6) Magnetic pressure  
Keyword(7)  
Keyword(8)  
1st Author's Name Tomokatsu Aizawa  
1st Author's Affiliation Tokyo Metropolitan College of Industrial Technology (Tokyo Metropolitan College)
2nd Author's Name Keigo Okagawa  
2nd Author's Affiliation Tokyo Metropolitan College of Industrial Technology (Tokyo Metropolitan College)
3rd Author's Name Yuho Yoshida  
3rd Author's Affiliation Yokodai.JP CORPORATION (Yokodai.JP)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker
Date Time 2010-07-16 13:00:00 
Presentation Time 25 
Registration for EMD 
Paper # IEICE-EMCJ2010-33,IEICE-EMD2010-18 
Volume (vol) IEICE-110 
Number (no) no.132(EMCJ), no.133(EMD) 
Page pp.7-12 
#Pages IEICE-6 
Date of Issue IEICE-EMCJ-2010-07-09,IEICE-EMD-2010-07-09 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan