Paper Abstract and Keywords |
Presentation |
2010-06-17 15:15
Fabrication of high-frequency and high-power AlGaN/GaN HEMTs Yoshimi Yamashita, Issei Watanabe, Akira Endoh, Nobumitsu Hirose, Toshiaki Matsui (NICT), Takashi Mimura (NICT/Fujitsu lab.) ED2010-38 Link to ES Tech. Rep. Archives: ED2010-38 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
High-power AlGaN/GaN high electron mobility transistors (HEMTs) are the most promising devices for future high-speed and long-range wireless communications to transmit large amount of data; this is because of these transistors can operate at millimeter-wave frequency band (30-300 GHz). In this contribution, we improved radio frequency (RF) and output power characteristics of the AlGaN/GaN MIS-HEMTs with SiN/SiO2/SiN triple-layer insulators by decreasing gate length (Lg), source-drain spacing (Lsd) and thickness of AlGaN barrier layer. As the Lsd decreasing from 2.0 μm to 1.0 μm, the drain current (Id), transconductance (gm), cutoff frequency (fT) and maximum oscillation frequency (fmax) were increased, and we achieved high fT of 188 GHz and fmax of 173 GHz for the 45-nm-gate MIS-HEMT. Furthermore, we also obtained high gain of 5.1 dB and output power density of 182 mW/mm at a frequency of 85 GHz for the MIS-HEMT with 80-nm-long and 100-μm-width gates. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
AlGaN/GaN MIS-HEMT / SiN/SiO2/SiN triple-layer insulators / RF and output power characteristic / / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 110, no. 80, ED2010-38, pp. 25-30, June 2010. |
Paper # |
ED2010-38 |
Date of Issue |
2010-06-10 (ED) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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ED2010-38 Link to ES Tech. Rep. Archives: ED2010-38 |
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