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Paper Abstract and Keywords
Presentation 2010-05-27 11:20
Acoustic damping effect on capacitive micromachined ultrasonic transducer
Seung-Mok Lee (Ingen MSL), Bu-Sang Cha, Masanori Okuyama (Osaka Univ.) EA2010-15 SIP2010-15 SP2010-15
Abstract (in Japanese) (See Japanese page) 
(in English) Acoustic damping of a capacitive micromachined ultrasonic transducer in air makes a mechanical impedance in the membrane vibration, which plays an important role in the transformation efficiency of the device. We present the acoustic damping effect on the transformation efficiency of CMUT device, and those results are compared with the other factors such as capacitance variations originated from the change of air-hole rate (AR) in the total membrane area. Damping ratio of perforated membrane plate is computed under each condition, and the results of that are introduced to the calculation of membrane displacement using finite element method for the consideration of squeeze-film damping effect. Q factor and transformation efficiency of the CMUT device under the various AR of the membrane and device dimension conditions are studied, and the acoustic damping effect is discussed for the design optimization of that.
Keyword (in Japanese) (See Japanese page) 
(in English) CMUT / Damping / Transformation efficiency / / / / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 54, EA2010-15, pp. 85-89, May 2010.
Paper # EA2010-15 
Date of Issue 2010-05-19 (EA, SIP, SP) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EA2010-15 SIP2010-15 SP2010-15

Conference Information
Committee SP EA SIP  
Conference Date 2010-05-26 - 2010-05-27 
Place (in Japanese) (See Japanese page) 
Place (in English) Konan Univ. (Hirao Seminar House) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Speech, Engineering/Electro Acoustics, Signal Processing,and Related Topics 
Paper Information
Registration To EA 
Conference Code 2010-05-SP-EA-SIP 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Acoustic damping effect on capacitive micromachined ultrasonic transducer 
Sub Title (in English)  
Keyword(1) CMUT  
Keyword(2) Damping  
Keyword(3) Transformation efficiency  
1st Author's Name Seung-Mok Lee  
1st Author's Affiliation Ingen MSL Inc. (Ingen MSL)
2nd Author's Name Bu-Sang Cha  
2nd Author's Affiliation Osaka University (Osaka Univ.)
3rd Author's Name Masanori Okuyama  
3rd Author's Affiliation Osaka University (Osaka Univ.)
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Date Time 2010-05-27 11:20:00 
Presentation Time 25 
Registration for EA 
Paper # IEICE-EA2010-15,IEICE-SIP2010-15,IEICE-SP2010-15 
Volume (vol) IEICE-110 
Number (no) no.54(EA), no.55(SIP), no.56(SP) 
Page pp.85-89 
#Pages IEICE-5 
Date of Issue IEICE-EA-2010-05-19,IEICE-SIP-2010-05-19,IEICE-SP-2010-05-19 

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