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| Presentation | 2010-02-19 13:00 A Study on Improvement for Seal property of Electromechanical Devices -- The behavior of One-Part Epoxy Resin in a narrow gap -- Osamu Otani, Seiji Nakajima, Tomohiro Fukuhara (OMRON Corp.)  R2009-51 EMD2009-118 Link to ES Tech. Rep. Archives: EMD2009-118 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Generally, one-part epoxy resin consists of liquid epoxy monomer, solid curing agent, and filler as a packing agent and so on. One-part epoxy resin is handled easy because the state of one-part epoxy resin is transformed from liquid to solid by the chemical reaction between liquid epoxy monomer and solid curing agent induced by just heating. One-part epoxy resin is widely used as a sealant of electro devices due to the above mentioned property and toughness and so on. With smaller size, higher density, and slimmer down of electro devices recently, the thickness and width of adhesion moieties in various parts come to be much smaller. In case of that the thickness of adhesion moieties is less than 100μm, solid epoxy resin and liquid epoxy monomer domains, which separated from the solid moieties, were observed even after heating. The liquid epoxy monomer domains were thought to be resulted in lowering of sealing property, but the separation mechanism has not been clarified. We report the separation mechanism and depression method of liquid epoxy monomer domains in narrow gap after heating. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Electromechanical device / Adhesion reliability / One-part epoxy resin / / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 109, no. 420, EMD2009-118, pp. 7-11, Feb. 2010. | |
| Paper # | EMD2009-118 | |
| Date of Issue | 2010-02-12 (R, EMD) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | R2009-51 EMD2009-118 Link to ES Tech. Rep. Archives: EMD2009-118 |
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| Conference Information | |
| Committee | EMD R |
| Conference Date | 2010-02-19 - 2010-02-19 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | EMD |
| Conference Code | 2010-02-EMD-R |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A Study on Improvement for Seal property of Electromechanical Devices |
| Sub Title (in English) | The behavior of One-Part Epoxy Resin in a narrow gap |
| Keyword(1) | Electromechanical device |
| Keyword(2) | Adhesion reliability |
| Keyword(3) | One-part epoxy resin |
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| 1st Author's Name | Osamu Otani |
| 1st Author's Affiliation | OMRON Corporation (OMRON Corp.) |
| 2nd Author's Name | Seiji Nakajima |
| 2nd Author's Affiliation | OMRON Corporation (OMRON Corp.) |
| 3rd Author's Name | Tomohiro Fukuhara |
| 3rd Author's Affiliation | OMRON Corporation (OMRON Corp.) |
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| Speaker | Author-1 |
| Date Time | 2010-02-19 13:00:00 |
| Presentation Time | 25 minutes |
| Registration for | EMD |
| Paper # | R2009-51, EMD2009-118 |
| Volume (vol) | vol.109 |
| Number (no) | no.419(R), no.420(EMD) |
| Page | pp.7-11 |
| #Pages | 5 |
| Date of Issue | 2010-02-12 (R, EMD) |
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