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| Presentation | 2010-02-05 13:00 Advanced Direct-CMP Process for Porous Low-k Thin Film Hayato Korogi (Panasonic), Hiroyuki Chibahara (Renesas), S. Suzuki, M. Tsutsue (Panasonic), K. Seo (Panasonic Semiconductor Engineering), Y. Oka, K. Goto, M. Akazaw, Hiroshi Miyatake (Renesas), S. Matsumoto, T. Ueda (Panasonic)  SDM2009-185 Link to ES Tech. Rep. Archives: SDM2009-185 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | In order to reduce the effective dielectric constant (keff) for the 32 nm technology node and beyond, Direct-CMP of a porous low-k film without a protective cap layer is required. However, the degradation of breakdown electric field (Ebd) has been one of critical issues. This study clarified that the Ebd degradation was caused by the pit defects on the surface of porous low-k film during Direct-CMP. Furthermore, we demonstrated that CMP pads with low-density micro-pores drastically reduced them and improved the Ebd degradation. In this paper, the mechanism for their reduction is also discussed. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Direct-CMP / Porous Low-k / Ebd / Pit defect / CMP pad / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 109, no. 412, SDM2009-185, pp. 19-23, Feb. 2010. | |
| Paper # | SDM2009-185 | |
| Date of Issue | 2010-01-29 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2009-185 Link to ES Tech. Rep. Archives: SDM2009-185 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2010-02-05 - 2010-02-05 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2010-02-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Advanced Direct-CMP Process for Porous Low-k Thin Film |
| Sub Title (in English) | |
| Keyword(1) | Direct-CMP |
| Keyword(2) | Porous Low-k |
| Keyword(3) | Ebd |
| Keyword(4) | Pit defect |
| Keyword(5) | CMP pad |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Hayato Korogi |
| 1st Author's Affiliation | Panasonic Corp. (Panasonic) |
| 2nd Author's Name | Hiroyuki Chibahara |
| 2nd Author's Affiliation | Renesas Technology Corp. (Renesas) |
| 3rd Author's Name | S. Suzuki |
| 3rd Author's Affiliation | Panasonic Corp. (Panasonic) |
| 4th Author's Name | M. Tsutsue |
| 4th Author's Affiliation | Panasonic Corp. (Panasonic) |
| 5th Author's Name | K. Seo |
| 5th Author's Affiliation | Panasonic Semiconductor Engineering Co., Ltd. (Panasonic Semiconductor Engineering) |
| 6th Author's Name | Y. Oka |
| 6th Author's Affiliation | Renesas Technology Corp. (Renesas) |
| 7th Author's Name | K. Goto |
| 7th Author's Affiliation | Renesas Technology Corp. (Renesas) |
| 8th Author's Name | M. Akazaw |
| 8th Author's Affiliation | Renesas Technology Corp. (Renesas) |
| 9th Author's Name | Hiroshi Miyatake |
| 9th Author's Affiliation | Renesas Technology Corp. (Renesas) |
| 10th Author's Name | S. Matsumoto |
| 10th Author's Affiliation | Panasonic Corp. (Panasonic) |
| 11th Author's Name | T. Ueda |
| 11th Author's Affiliation | Panasonic Corp. (Panasonic) |
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| Speaker | Author-1 |
| Date Time | 2010-02-05 13:00:00 |
| Presentation Time | 30 minutes |
| Registration for | SDM |
| Paper # | SDM2009-185 |
| Volume (vol) | vol.109 |
| Number (no) | no.412 |
| Page | pp.19-23 |
| #Pages | 5 |
| Date of Issue | 2010-01-29 (SDM) |
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