IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2010-01-22 13:55
Electromagnetic Forming of Conical Spring Shrunken in Shape of Plane for Electronic Parts
Tomokatsu Aizawa, Keigo Okagawa (Tokyo Metro Coll.), Hiroaki Miyazaki, Takuto Shimojou (Topre Corp.) EMD2009-113 Link to ES Tech. Rep. Archives: EMD2009-113
Abstract (in Japanese) (See Japanese page) 
(in English) This paper describes an electromagnetic forming technique for conical springs of electronic parts and its experimental results. When an impulse current from a capacitor bank passes through a flat one-turn coil, a magnetic flux is suddenly generated around the coil. Eddy currents are induced in a insulated copper sheet (or overlapped aluminum and copper alloy sheets) fixed between the coil and a die. Magnetic pressure asts on each sheat. The copper or copper alloy sheet is sheared and formed for conical springs. The formed springs shrink in a plane.
Keyword (in Japanese) (See Japanese page) 
(in English) Conical spring / Capacitive switch / Electromagnetic forming / Magnetic pressure / Flat one-turn coil / / /  
Reference Info. IEICE Tech. Rep., vol. 109, no. 385, EMD2009-113, pp. 7-10, Jan. 2010.
Paper # EMD2009-113 
Date of Issue 2010-01-15 (EMD) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2009-113 Link to ES Tech. Rep. Archives: EMD2009-113

Conference Information
Committee EMD  
Conference Date 2010-01-22 - 2010-01-22 
Place (in Japanese) (See Japanese page) 
Place (in English) Rental Hall Shonan Hiratsuka 
Topics (in Japanese) (See Japanese page) 
Topics (in English) General 
Paper Information
Registration To EMD 
Conference Code 2010-01-EMD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Electromagnetic Forming of Conical Spring Shrunken in Shape of Plane for Electronic Parts 
Sub Title (in English)  
Keyword(1) Conical spring  
Keyword(2) Capacitive switch  
Keyword(3) Electromagnetic forming  
Keyword(4) Magnetic pressure  
Keyword(5) Flat one-turn coil  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Tomokatsu Aizawa  
1st Author's Affiliation Tokyo Metropolitan College of Industrial Technology (Tokyo Metro Coll.)
2nd Author's Name Keigo Okagawa  
2nd Author's Affiliation Tokyo Metropolitan College of Industrial Technology (Tokyo Metro Coll.)
3rd Author's Name Hiroaki Miyazaki  
3rd Author's Affiliation Topre Corporation (Topre Corp.)
4th Author's Name Takuto Shimojou  
4th Author's Affiliation Topre Corporation (Topre Corp.)
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker
Date Time 2010-01-22 13:55:00 
Presentation Time 25 
Registration for EMD 
Paper # IEICE-EMD2009-113 
Volume (vol) IEICE-109 
Number (no) no.385 
Page pp.7-10 
#Pages IEICE-4 
Date of Issue IEICE-EMD-2010-01-15 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan