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Paper Abstract and Keywords
Presentation 2009-12-18 13:30
Magnetic Pulse Welding of a Copper Sheet to Metal Pillars (Copper Bumps)
Tomokatsu Aizawa, Keigo Okagawa (Tokyo Metropolitan College), Tetsuo Machida (Nihon Multi) EMD2009-107 Link to ES Tech. Rep. Archives: EMD2009-107
Abstract (in Japanese) (See Japanese page) 
(in English) This paper describes a new joining method of a copper sheet to metal pillars (copper bumps) and its experimental results. The pillars are put in holes of a thin insulator and near the sheet. When an impulse current from a capacitor bank passes through a flat one-turn coil, a magnetic flux is suddenly generated around the coil. Eddy currents are induced in the sheet placed between the coil and the insulator. Electromagnetic force acts on the sheet. The sheet can be welded to the pillers both by the Joule heat and by the high-speed collision to the pillers. The bank energy required for this welding is less than 2 kJ.
Keyword (in Japanese) (See Japanese page) 
(in English) Magnetic pulse welding / Electromagnetic force / joining / Copper bump / Large-current circuit board / / /  
Reference Info. IEICE Tech. Rep., vol. 109, no. 352, EMD2009-107, pp. 7-10, Dec. 2009.
Paper # EMD2009-107 
Date of Issue 2009-12-11 (EMD) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2009-107 Link to ES Tech. Rep. Archives: EMD2009-107

Conference Information
Committee EMD  
Conference Date 2009-12-18 - 2009-12-18 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMD 
Conference Code 2009-12-EMD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Magnetic Pulse Welding of a Copper Sheet to Metal Pillars (Copper Bumps) 
Sub Title (in English)  
Keyword(1) Magnetic pulse welding  
Keyword(2) Electromagnetic force  
Keyword(3) joining  
Keyword(4) Copper bump  
Keyword(5) Large-current circuit board  
1st Author's Name Tomokatsu Aizawa  
1st Author's Affiliation Tokyo Metropolitan College of Industrial Technology (Tokyo Metropolitan College)
2nd Author's Name Keigo Okagawa  
2nd Author's Affiliation Tokyo Metropolitan College of Industrial Technology (Tokyo Metropolitan College)
3rd Author's Name Tetsuo Machida  
3rd Author's Affiliation Nihon Multi Corporation (Nihon Multi)
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Date Time 2009-12-18 13:30:00 
Presentation Time 25 
Registration for EMD 
Paper # IEICE-EMD2009-107 
Volume (vol) IEICE-109 
Number (no) no.352 
Page pp.7-10 
#Pages IEICE-4 
Date of Issue IEICE-EMD-2009-12-11 

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