講演抄録/キーワード |
講演名 |
2009-12-03 10:20
電源系ターゲット・インピーダンスとパッケージ・デザインの考察 ○高橋成正・小坂善幸・石井正俊(日本IBM)・城下 誠(京セラSLCテクノロジー) CPM2009-144 ICD2009-73 エレソ技報アーカイブへのリンク:CPM2009-144 ICD2009-73 |
抄録 |
(和) |
(まだ登録されていません) |
(英) |
This paper describes the modeling analysis for a power distribution network and demonstrate co-design and co-simulation in using the detailed prototype model, which includes chip, package and printed circuit board. A circuit simulator and a 2D solver using the finite element method are used to study the frequency and transient responses for the core switching noise. In the model, we assume a chip model (current profile and on-chip capacitance) and define the circuit parameters with an equivalent circuit to meet the target impedance. Then the physical design of the package and printed circuit board were done to check all of the required circuit parameters. According to the modeling and evaluation, the package design with both the low equivalent series inductance capacitors and the low equivalent series resistance capacitors in the bottom layer with a thin core structure is more advantageous than a capacitor in the top layer. |
キーワード |
(和) |
/ / / / / / / |
(英) |
power distribution network / power integrity / target impedance / co-design / co-simulation / / / |
文献情報 |
信学技報, vol. 109, no. 317, CPM2009-144, pp. 57-62, 2009年12月. |
資料番号 |
CPM2009-144 |
発行日 |
2009-11-25 (CPM, ICD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
著作権に ついて |
技術研究報告に掲載された論文の著作権は電子情報通信学会に帰属します.(許諾番号:10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
PDFダウンロード |
CPM2009-144 ICD2009-73 エレソ技報アーカイブへのリンク:CPM2009-144 ICD2009-73 |
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