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Paper Abstract and Keywords
Presentation 2009-11-20 15:00
50 W at 5 GHz RF output power performance of GaN-HEMT on Si substrate
Shinichi Hoshi, Masanori Itoh, Toshiharu Marui, Hideyuki Okita, Yoshiaki Morino, Isao Tamai, Fumihiko Toda, Shohei Seki (Oki Electric Industry Co., Ltd.), Takashi Egawa (Nagoya Inst. of Tech.) ED2009-157 CPM2009-131 LQE2009-136 Link to ES Tech. Rep. Archives: ED2009-157 CPM2009-131 LQE2009-136
Abstract (in Japanese) (See Japanese page) 
(in English) We have fabricated high RF power output devices using GaN-HEMT on Si substrate, that can be screened out by Hg probe C-V measurement about epi/sub interface issue in order to apply to RF power output applications. Then we have obtained the good RF power output characteristics of 48.8 dBm (75.6 W) with power added efficiency of 54.4% and thermal resistance of 2.76ºC/W at 2 GHz by 60 µm-thick Si substrate. These characteristics are almost compatible with those of GaN-HEMT on SiC devices we fabricated at the same time. We also evaluated the GaN-HEMT on Si devices at higher frequency and achieved the feasible performance of 7.58 W/mm and 47.14 dBm (51.8 W) at 5 GHz.
Keyword (in Japanese) (See Japanese page) 
(in English) GaN-HEMT on Si substrate / epi/sub interface / Thermal resistance / RF output power performance / / / /  
Reference Info. IEICE Tech. Rep., vol. 109, no. 288, ED2009-157, pp. 139-144, Nov. 2009.
Paper # ED2009-157 
Date of Issue 2009-11-12 (ED, CPM, LQE) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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Download PDF ED2009-157 CPM2009-131 LQE2009-136 Link to ES Tech. Rep. Archives: ED2009-157 CPM2009-131 LQE2009-136

Conference Information
Committee ED LQE CPM  
Conference Date 2009-11-19 - 2009-11-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Univ. of Tokushima (Josanjima Campus, Kogyo-Kaikan) 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To ED 
Conference Code 2009-11-ED-LQE-CPM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) 50 W at 5 GHz RF output power performance of GaN-HEMT on Si substrate 
Sub Title (in English)  
Keyword(1) GaN-HEMT on Si substrate  
Keyword(2) epi/sub interface  
Keyword(3) Thermal resistance  
Keyword(4) RF output power performance  
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Keyword(6)  
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Keyword(8)  
1st Author's Name Shinichi Hoshi  
1st Author's Affiliation Oki Electric Industry Co., Ltd. (Oki Electric Industry Co., Ltd.)
2nd Author's Name Masanori Itoh  
2nd Author's Affiliation Oki Electric Industry Co., Ltd. (Oki Electric Industry Co., Ltd.)
3rd Author's Name Toshiharu Marui  
3rd Author's Affiliation Oki Electric Industry Co., Ltd. (Oki Electric Industry Co., Ltd.)
4th Author's Name Hideyuki Okita  
4th Author's Affiliation Oki Electric Industry Co., Ltd. (Oki Electric Industry Co., Ltd.)
5th Author's Name Yoshiaki Morino  
5th Author's Affiliation Oki Electric Industry Co., Ltd. (Oki Electric Industry Co., Ltd.)
6th Author's Name Isao Tamai  
6th Author's Affiliation Oki Electric Industry Co., Ltd. (Oki Electric Industry Co., Ltd.)
7th Author's Name Fumihiko Toda  
7th Author's Affiliation Oki Electric Industry Co., Ltd. (Oki Electric Industry Co., Ltd.)
8th Author's Name Shohei Seki  
8th Author's Affiliation Oki Electric Industry Co., Ltd. (Oki Electric Industry Co., Ltd.)
9th Author's Name Takashi Egawa  
9th Author's Affiliation Nagoya Institute of Technology (Nagoya Inst. of Tech.)
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Speaker Author-1 
Date Time 2009-11-20 15:00:00 
Presentation Time 25 minutes 
Registration for ED 
Paper # ED2009-157, CPM2009-131, LQE2009-136 
Volume (vol) vol.109 
Number (no) no.288(ED), no.289(CPM), no.290(LQE) 
Page pp.139-144 
#Pages
Date of Issue 2009-11-12 (ED, CPM, LQE) 


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