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Paper Abstract and Keywords
Presentation 2009-11-13 11:15
A Novel Monte Carlo Simulation to Evaluate the Size Effect of Resistivity for Scaled Metallic Interconnects
Takashi Kurusu, Makoto Wada, Noriaki Matsunaga, Akihiro Kajita, Hiroyoshi Tanimoto, Nobutoshi Aoki, Yoshiaki Toyoshima, Hideki Shibata (Toshiba Corp.) SDM2009-145 Link to ES Tech. Rep. Archives: SDM2009-145
Abstract (in Japanese) (See Japanese page) 
(in English) Recently, the size effect on resistivity in very narrow and thin metallic wires is a crucial problem on development of small-scaled metallic interconnects. In this paper, we present a compact Monte Carlo method to accurately evaluate the size effect on resistivity in very narrow and thin metallic interconnects. It is shown that our method well reproduces the size effect in very narrow and thin copper wires, and a consideration of the geometric effect on resistivity is significant to accurately estimate the size effect.
Keyword (in Japanese) (See Japanese page) 
(in English) Monte Carlo method / size effect on resistivity / surface scattering / grain boundary scattering / geometric effect / / /  
Reference Info. IEICE Tech. Rep., vol. 109, no. 278, SDM2009-145, pp. 55-60, Nov. 2009.
Paper # SDM2009-145 
Date of Issue 2009-11-05 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2009-145 Link to ES Tech. Rep. Archives: SDM2009-145

Conference Information
Committee SDM  
Conference Date 2009-11-12 - 2009-11-13 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Process, Device, Circuit Simulation, etc. 
Paper Information
Registration To SDM 
Conference Code 2009-11-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Novel Monte Carlo Simulation to Evaluate the Size Effect of Resistivity for Scaled Metallic Interconnects 
Sub Title (in English)  
Keyword(1) Monte Carlo method  
Keyword(2) size effect on resistivity  
Keyword(3) surface scattering  
Keyword(4) grain boundary scattering  
Keyword(5) geometric effect  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Takashi Kurusu  
1st Author's Affiliation Device Process Development Center, Corporate Research & Develocpment Center, Toshiba Corporation (Toshiba Corp.)
2nd Author's Name Makoto Wada  
2nd Author's Affiliation Device Process Development Center, Corporate Research & Develocpment Center, Toshiba Corporation (Toshiba Corp.)
3rd Author's Name Noriaki Matsunaga  
3rd Author's Affiliation Device Process Development Center, Corporate Research & Develocpment Center, Toshiba Corporation (Toshiba Corp.)
4th Author's Name Akihiro Kajita  
4th Author's Affiliation Device Process Development Center, Corporate Research & Develocpment Center, Toshiba Corporation (Toshiba Corp.)
5th Author's Name Hiroyoshi Tanimoto  
5th Author's Affiliation Device Process Development Center, Corporate Research & Develocpment Center, Toshiba Corporation (Toshiba Corp.)
6th Author's Name Nobutoshi Aoki  
6th Author's Affiliation Device Process Development Center, Corporate Research & Develocpment Center, Toshiba Corporation (Toshiba Corp.)
7th Author's Name Yoshiaki Toyoshima  
7th Author's Affiliation Device Process Development Center, Corporate Research & Develocpment Center, Toshiba Corporation (Toshiba Corp.)
8th Author's Name Hideki Shibata  
8th Author's Affiliation Device Process Development Center, Corporate Research & Develocpment Center, Toshiba Corporation (Toshiba Corp.)
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Speaker Author-1 
Date Time 2009-11-13 11:15:00 
Presentation Time 25 minutes 
Registration for SDM 
Paper # SDM2009-145 
Volume (vol) vol.109 
Number (no) no.278 
Page pp.55-60 
#Pages
Date of Issue 2009-11-05 (SDM) 


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