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| Presentation | 2009-10-16 13:45 The Sealing Reliability of Electronics Mechanical Devices Tomohiro Fukuhara (OMRON Corp.)  R2009-34 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Relays are one of electronics mechanical devices, and they are used for various purposes. So relays are demand for high reliability under various conditions. Especially, Sealing relays are packaged with sealant to prevent from invasion of solder-flux, foreign matters, corrosive gas, etc. Adhesive property between adhesives and metallic terminals, base or case made from plastics affects reliability of relays. Sealing relays can classify two types according to soldering method. One is Surface Mount type. Another is Through Hole type. Especially, Surface Mount type relays are revealed that sealing reliability in soldering is deteriorated by humidity. We paid attention to the fact that the break points of sealing in soldering caused by humidity are near the interface between sealing agents and plastics. And we studied about effects of humidity for the interface between sealing agents and plastics. As a result, we revealed that the cohesive force in Liquid Crystal Polymer used as relay-case is deteriorated by humidity, and the deterioration of the cohesive force in Liquid Crystal Polymer caused the deterioration of sealing property in soldering. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Relay / Surface Mount Devices / Humidity / Sealing / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 109, no. 232, R2009-34, pp. 7-12, Oct. 2009. | |
| Paper # | R2009-34 | |
| Date of Issue | 2009-10-09 (R) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | R2009-34 |
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| Conference Information | |
| Committee | R |
| Conference Date | 2009-10-16 - 2009-10-16 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kyutech Plaza@Tenjin of Kyushu Institute of Technology |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Reliability and it's related topics |
| Paper Information | |
| Registration To | R |
| Conference Code | 2009-10-R |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | The Sealing Reliability of Electronics Mechanical Devices |
| Sub Title (in English) | |
| Keyword(1) | Relay |
| Keyword(2) | Surface Mount Devices |
| Keyword(3) | Humidity |
| Keyword(4) | Sealing |
| Keyword(5) | |
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| 1st Author's Name | Tomohiro Fukuhara |
| 1st Author's Affiliation | Omron Cooperation (OMRON Corp.) |
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| Speaker | Author-1 |
| Date Time | 2009-10-16 13:45:00 |
| Presentation Time | 25 minutes |
| Registration for | R |
| Paper # | R2009-34 |
| Volume (vol) | vol.109 |
| Number (no) | no.232 |
| Page | pp.7-12 |
| #Pages | 6 |
| Date of Issue | 2009-10-09 (R) |
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