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Paper Abstract and Keywords
Presentation 2009-10-16 13:45
The Sealing Reliability of Electronics Mechanical Devices
Tomohiro Fukuhara (OMRON Corp.) R2009-34
Abstract (in Japanese) (See Japanese page) 
(in English) Relays are one of electronics mechanical devices, and they are used for various purposes. So relays are demand for high reliability under various conditions. Especially, Sealing relays are packaged with sealant to prevent from invasion of solder-flux, foreign matters, corrosive gas, etc. Adhesive property between adhesives and metallic terminals, base or case made from plastics affects reliability of relays. Sealing relays can classify two types according to soldering method. One is Surface Mount type. Another is Through Hole type. Especially, Surface Mount type relays are revealed that sealing reliability in soldering is deteriorated by humidity. We paid attention to the fact that the break points of sealing in soldering caused by humidity are near the interface between sealing agents and plastics. And we studied about effects of humidity for the interface between sealing agents and plastics. As a result, we revealed that the cohesive force in Liquid Crystal Polymer used as relay-case is deteriorated by humidity, and the deterioration of the cohesive force in Liquid Crystal Polymer caused the deterioration of sealing property in soldering.
Keyword (in Japanese) (See Japanese page) 
(in English) Relay / Surface Mount Devices / Humidity / Sealing / / / /  
Reference Info. IEICE Tech. Rep., vol. 109, no. 232, R2009-34, pp. 7-12, Oct. 2009.
Paper # R2009-34 
Date of Issue 2009-10-09 (R) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee R  
Conference Date 2009-10-16 - 2009-10-16 
Place (in Japanese) (See Japanese page) 
Place (in English) Kyutech Plaza@Tenjin of Kyushu Institute of Technology 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Reliability and it's related topics 
Paper Information
Registration To R 
Conference Code 2009-10-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) The Sealing Reliability of Electronics Mechanical Devices 
Sub Title (in English)  
Keyword(1) Relay  
Keyword(2) Surface Mount Devices  
Keyword(3) Humidity  
Keyword(4) Sealing  
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1st Author's Name Tomohiro Fukuhara  
1st Author's Affiliation Omron Cooperation (OMRON Corp.)
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Speaker
Date Time 2009-10-16 13:45:00 
Presentation Time 25 
Registration for R 
Paper # IEICE-R2009-34 
Volume (vol) IEICE-109 
Number (no) no.232 
Page pp.7-12 
#Pages IEICE-6 
Date of Issue IEICE-R-2009-10-09 


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