Paper Abstract and Keywords |
Presentation |
2009-06-24 17:00
Simulation and Experiment of Liquid-Phase Microjoining Using Cone-Shaped Compliant Bump Lijing Qiu (Kyushu Univ.), Naoya Watanabe (Fukuoka-IST), Tanemasa Asano (Kyushu Univ.) ED2009-66 SDM2009-61 Link to ES Tech. Rep. Archives: ED2009-66 SDM2009-61 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
In order to meet the requirements of high-density interconnection in 3D-LSI, we have proposed easy-deforming compliant bumps (10 μm-diameter / 20 μm-pitch) to lower the pressing load during bonding. But still, when the number of I/O connections approaches to or larger than 1,000,000, the pressing load becomes too heavier to be carried out by an available flip-chip bonder. The load problems of compliant bumps can be overcome by liquid phase bonding method. On the other hand, the shrinkage of bump pitch is restricted by the spread of melting solder as far as the existing bump technology is used. In this paper, this constraint can be overcome by using the cone-shaped compliant bump as a counter electrode of solder bump. We show experimental results together with simulation of fluid dynamics of molten solder. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
compliant bump / solder electrodes / liquid phase bonding / simulation / interconnection / / / |
Reference Info. |
IEICE Tech. Rep., vol. 109, no. 98, SDM2009-61, pp. 71-74, June 2009. |
Paper # |
SDM2009-61 |
Date of Issue |
2009-06-17 (ED, SDM) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
ED2009-66 SDM2009-61 Link to ES Tech. Rep. Archives: ED2009-66 SDM2009-61 |
Conference Information |
Committee |
SDM ED |
Conference Date |
2009-06-24 - 2009-06-26 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Haeundae Grand Hotel, Busan, Korea |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
2009 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices |
Paper Information |
Registration To |
SDM |
Conference Code |
2009-06-SDM-ED |
Language |
English |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Simulation and Experiment of Liquid-Phase Microjoining Using Cone-Shaped Compliant Bump |
Sub Title (in English) |
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Keyword(1) |
compliant bump |
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solder electrodes |
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liquid phase bonding |
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simulation |
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interconnection |
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1st Author's Name |
Lijing Qiu |
1st Author's Affiliation |
Kyushu University (Kyushu Univ.) |
2nd Author's Name |
Naoya Watanabe |
2nd Author's Affiliation |
Fukuoka Industry, Science & Technology Foundation (Fukuoka-IST) |
3rd Author's Name |
Tanemasa Asano |
3rd Author's Affiliation |
Kyushu University (Kyushu Univ.) |
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Speaker |
Author-1 |
Date Time |
2009-06-24 17:00:00 |
Presentation Time |
15 minutes |
Registration for |
SDM |
Paper # |
ED2009-66, SDM2009-61 |
Volume (vol) |
vol.109 |
Number (no) |
no.97(ED), no.98(SDM) |
Page |
pp.71-74 |
#Pages |
4 |
Date of Issue |
2009-06-17 (ED, SDM) |
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