IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2009-06-24 17:00
Simulation and Experiment of Liquid-Phase Microjoining Using Cone-Shaped Compliant Bump
Lijing Qiu (Kyushu Univ.), Naoya Watanabe (Fukuoka-IST), Tanemasa Asano (Kyushu Univ.) ED2009-66 SDM2009-61 Link to ES Tech. Rep. Archives: ED2009-66 SDM2009-61
Abstract (in Japanese) (See Japanese page) 
(in English) In order to meet the requirements of high-density interconnection in 3D-LSI, we have proposed easy-deforming compliant bumps (10 μm-diameter / 20 μm-pitch) to lower the pressing load during bonding. But still, when the number of I/O connections approaches to or larger than 1,000,000, the pressing load becomes too heavier to be carried out by an available flip-chip bonder. The load problems of compliant bumps can be overcome by liquid phase bonding method. On the other hand, the shrinkage of bump pitch is restricted by the spread of melting solder as far as the existing bump technology is used. In this paper, this constraint can be overcome by using the cone-shaped compliant bump as a counter electrode of solder bump. We show experimental results together with simulation of fluid dynamics of molten solder.
Keyword (in Japanese) (See Japanese page) 
(in English) compliant bump / solder electrodes / liquid phase bonding / simulation / interconnection / / /  
Reference Info. IEICE Tech. Rep., vol. 109, no. 98, SDM2009-61, pp. 71-74, June 2009.
Paper # SDM2009-61 
Date of Issue 2009-06-17 (ED, SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF ED2009-66 SDM2009-61 Link to ES Tech. Rep. Archives: ED2009-66 SDM2009-61

Conference Information
Committee SDM ED  
Conference Date 2009-06-24 - 2009-06-26 
Place (in Japanese) (See Japanese page) 
Place (in English) Haeundae Grand Hotel, Busan, Korea 
Topics (in Japanese) (See Japanese page) 
Topics (in English) 2009 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices 
Paper Information
Registration To SDM 
Conference Code 2009-06-SDM-ED 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Simulation and Experiment of Liquid-Phase Microjoining Using Cone-Shaped Compliant Bump 
Sub Title (in English)  
Keyword(1) compliant bump  
Keyword(2) solder electrodes  
Keyword(3) liquid phase bonding  
Keyword(4) simulation  
Keyword(5) interconnection  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Lijing Qiu  
1st Author's Affiliation Kyushu University (Kyushu Univ.)
2nd Author's Name Naoya Watanabe  
2nd Author's Affiliation Fukuoka Industry, Science & Technology Foundation (Fukuoka-IST)
3rd Author's Name Tanemasa Asano  
3rd Author's Affiliation Kyushu University (Kyushu Univ.)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2009-06-24 17:00:00 
Presentation Time 15 minutes 
Registration for SDM 
Paper # ED2009-66, SDM2009-61 
Volume (vol) vol.109 
Number (no) no.97(ED), no.98(SDM) 
Page pp.71-74 
#Pages
Date of Issue 2009-06-17 (ED, SDM) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan