Paper Abstract and Keywords |
Presentation |
2009-06-12 10:20
In-situ etching by CBr4 in InP heterojunction bipolar transistors with buried SiO2 wire Naoaki Takebe, Hiroaki Yamashita, Shinnosuke Takahashi, Hisashi Saito, Takashi Kobayashi, Yasuyuki Miyamoto, Kazuhito Furuya (Tokyo Inst. of Tech.) ED2009-46 Link to ES Tech. Rep. Archives: ED2009-46 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
In order to obtain high-speed InP heterojunction bipolar transistors (HBTs), it is necessary to reduce the base-collector capacitance ($C_{\{BC}}$) under the base electrode. Thus we proposed buried glass heterojunction bipolar transistor (BG-HBT) which had SiO_2 wires in the collector. By SiO_2 wires buried in the InP collector layer, we can obtain reduced $C_{\{BC}}$ because of its low dielectric constant. From equivalent circuit analysis, reduction of InP thickness over buried SiO_2 ($T_{\{top}}$) enhance the performance of BG-HBT. To realize such structure, we introduced in-situ etching of InP layer by introduction of CBr_4 after SiO_2 buried growth. Ttop was reduced to 1/4 by in-situ etching with the flat InP surface. We confirmed that C-doping by etching has no effect on fabrication of a BG-HBT by SIMS analysis. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
heterojunction bipolar transistor / InP / MOVPE / SiO2 wire / CBr4 / / / |
Reference Info. |
IEICE Tech. Rep., vol. 109, no. 81, ED2009-46, pp. 51-55, June 2009. |
Paper # |
ED2009-46 |
Date of Issue |
2009-06-04 (ED) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
ED2009-46 Link to ES Tech. Rep. Archives: ED2009-46 |