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Paper Abstract and Keywords
Presentation 2009-06-05 13:35
A Study on Shield Structure of a Connector Substrate with Single Point Ground Plane Connection
Satoshi Yoneda (Mitsubishi Electric Corp.), Takefumi Kumamoto (Mitsubishi Electric Engineering Co.Ltd.), Chiharu Miyazaki, Naoto Oka (Mitsubishi Electric Corp.) EMCJ2009-28
Abstract (in Japanese) (See Japanese page) 
(in English) In recent years, noise radiation from a connector substrate which consists of printed boards and a connector sometimes come to be a problem. To reduce the noise, electrical connections between ground planes of the printed boards is well known as a shield structure. To enhance the shielding effect, multipoint ground plane connection is often applied. On the other hand, there are no guidelines for designing shield structure with less point ground plane connections, though the structure is sometimes required for some reasons such as distribution rule and design condition of the printed boards. In this paper, a study on shield structure of a connector substrate with single point ground plane connection is reported to improve the problem. A prototype shield structure is fabricated first, using epoxy substrates and metal rods. The measured results agreed well with the EM-analyses results, which proved validity of the EM-analyses. Using the EM-analyses, a guideline for designing shield structure of a connector substrate with single point ground plane connection was obtained.
Keyword (in Japanese) (See Japanese page) 
(in English) EMC / EMI / PCB / connector substrate / shield structure / ground plane connection / /  
Reference Info. IEICE Tech. Rep., vol. 109, no. 76, EMCJ2009-28, pp. 35-39, June 2009.
Paper # EMCJ2009-28 
Date of Issue 2009-05-29 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee EMCJ  
Conference Date 2009-06-05 - 2009-06-05 
Place (in Japanese) (See Japanese page) 
Place (in English) Tokyo Big Sight (Tokyo International Exihibition Center) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Young Scientists Award for Excellent Presentations 
Paper Information
Registration To EMCJ 
Conference Code 2009-06-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Study on Shield Structure of a Connector Substrate with Single Point Ground Plane Connection 
Sub Title (in English)  
Keyword(1) EMC  
Keyword(2) EMI  
Keyword(3) PCB  
Keyword(4) connector substrate  
Keyword(5) shield structure  
Keyword(6) ground plane connection  
Keyword(7)  
Keyword(8)  
1st Author's Name Satoshi Yoneda  
1st Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
2nd Author's Name Takefumi Kumamoto  
2nd Author's Affiliation Mitsubishi Electric Engineering Co.Ltd. (Mitsubishi Electric Engineering Co.Ltd.)
3rd Author's Name Chiharu Miyazaki  
3rd Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
4th Author's Name Naoto Oka  
4th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
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Speaker Author-1 
Date Time 2009-06-05 13:35:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2009-28 
Volume (vol) vol.109 
Number (no) no.76 
Page pp.35-39 
#Pages
Date of Issue 2009-05-29 (EMCJ) 


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