Paper Abstract and Keywords |
Presentation |
2009-03-09 14:20
Millimeter-Wave Dipole Antenna on a Thick Resin Layer on the Back Side of a Silicon CMOS Chip Jiro Hirokawa, Kenta Kimishima, Makoto Ando (Tokyo Inst. of Tech.), Yasutake Hirachi (Ammsys Inc.) AP2008-217 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
This paper proposes a dipole antenna integrated on a thick resin layer on the opposite side of a RF circuit layer though a hole in a silicon CMOS chip at 60GHz. The thick resin layer can enhance the radiation efficiency. The connection loss between the antenna and the RF circuit is expected to be small. The simulated gain of a dipole on a resin layer of 200m thickness over a 5mm square silicon chip is 5.4dBi. The measured gain of 3.1dBi is achieved even though the reflection is 6dB. The roughness of the sidewalls of the hole and posts by laser opening, the spread of thin copper with 2mm thickness and the connection loss in the measurement could degrade the gain. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Millimeter wave / Silicon chip / Dipole / Thick resin layer / Radiation efficiency / / / |
Reference Info. |
IEICE Tech. Rep., vol. 108, no. 475, AP2008-217, pp. 33-36, March 2009. |
Paper # |
AP2008-217 |
Date of Issue |
2009-03-02 (AP) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
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AP2008-217 |
Conference Information |
Committee |
AP |
Conference Date |
2009-03-09 - 2009-03-10 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
University of Macau |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
Antennas and Propagation |
Paper Information |
Registration To |
AP |
Conference Code |
2009-03-AP |
Language |
English |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Millimeter-Wave Dipole Antenna on a Thick Resin Layer on the Back Side of a Silicon CMOS Chip |
Sub Title (in English) |
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Millimeter wave |
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Silicon chip |
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Dipole |
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Thick resin layer |
Keyword(5) |
Radiation efficiency |
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1st Author's Name |
Jiro Hirokawa |
1st Author's Affiliation |
Tokyo Institute of Technology (Tokyo Inst. of Tech.) |
2nd Author's Name |
Kenta Kimishima |
2nd Author's Affiliation |
Tokyo Institute of Technology (Tokyo Inst. of Tech.) |
3rd Author's Name |
Makoto Ando |
3rd Author's Affiliation |
Tokyo Institute of Technology (Tokyo Inst. of Tech.) |
4th Author's Name |
Yasutake Hirachi |
4th Author's Affiliation |
Ammsys Inc. (Ammsys Inc.) |
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Speaker |
Author-1 |
Date Time |
2009-03-09 14:20:00 |
Presentation Time |
25 minutes |
Registration for |
AP |
Paper # |
AP2008-217 |
Volume (vol) |
vol.108 |
Number (no) |
no.475 |
Page |
pp.33-36 |
#Pages |
4 |
Date of Issue |
2009-03-02 (AP) |