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Paper Abstract and Keywords
Presentation 2009-03-09 14:20
Millimeter-Wave Dipole Antenna on a Thick Resin Layer on the Back Side of a Silicon CMOS Chip
Jiro Hirokawa, Kenta Kimishima, Makoto Ando (Tokyo Inst. of Tech.), Yasutake Hirachi (Ammsys Inc.) AP2008-217
Abstract (in Japanese) (See Japanese page) 
(in English) This paper proposes a dipole antenna integrated on a thick resin layer on the opposite side of a RF circuit layer though a hole in a silicon CMOS chip at 60GHz. The thick resin layer can enhance the radiation efficiency. The connection loss between the antenna and the RF circuit is expected to be small. The simulated gain of a dipole on a resin layer of 200m thickness over a 5mm square silicon chip is 5.4dBi. The measured gain of 3.1dBi is achieved even though the reflection is 6dB. The roughness of the sidewalls of the hole and posts by laser opening, the spread of thin copper with 2mm thickness and the connection loss in the measurement could degrade the gain.
Keyword (in Japanese) (See Japanese page) 
(in English) Millimeter wave / Silicon chip / Dipole / Thick resin layer / Radiation efficiency / / /  
Reference Info. IEICE Tech. Rep., vol. 108, no. 475, AP2008-217, pp. 33-36, March 2009.
Paper # AP2008-217 
Date of Issue 2009-03-02 (AP) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee AP  
Conference Date 2009-03-09 - 2009-03-10 
Place (in Japanese) (See Japanese page) 
Place (in English) University of Macau 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Antennas and Propagation 
Paper Information
Registration To AP 
Conference Code 2009-03-AP 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Millimeter-Wave Dipole Antenna on a Thick Resin Layer on the Back Side of a Silicon CMOS Chip 
Sub Title (in English)  
Keyword(1) Millimeter wave  
Keyword(2) Silicon chip  
Keyword(3) Dipole  
Keyword(4) Thick resin layer  
Keyword(5) Radiation efficiency  
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1st Author's Name Jiro Hirokawa  
1st Author's Affiliation Tokyo Institute of Technology (Tokyo Inst. of Tech.)
2nd Author's Name Kenta Kimishima  
2nd Author's Affiliation Tokyo Institute of Technology (Tokyo Inst. of Tech.)
3rd Author's Name Makoto Ando  
3rd Author's Affiliation Tokyo Institute of Technology (Tokyo Inst. of Tech.)
4th Author's Name Yasutake Hirachi  
4th Author's Affiliation Ammsys Inc. (Ammsys Inc.)
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Speaker Author-1 
Date Time 2009-03-09 14:20:00 
Presentation Time 25 minutes 
Registration for AP 
Paper # AP2008-217 
Volume (vol) vol.108 
Number (no) no.475 
Page pp.33-36 
#Pages
Date of Issue 2009-03-02 (AP) 


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