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Paper Abstract and Keywords
Presentation 2009-02-20 13:45
Pull strength analysis of Pb free solder at a connected point
Taku Hashiguchi, Yuta Nasukawa, Kazunori Hiraoka (Salesian Polytecn.) R2008-51 EMD2008-127 Link to ES Tech. Rep. Archives: EMD2008-127
Abstract (in Japanese) (See Japanese page) 
(in English) Pull strength of Pb free solder at a connected point is tested and analyzed.
Experiments are performed with various parameters as solder metal, soldering method and diameter of lead wire. Pull strength test and the high temperature storage test are performed to analyze the effect of soldering conditions.
Experimental results are analyzed using Hayashi’s quantification methods. It is shown that the pull strength of Pb free solder is nearly equal to that of Pb solder. Results of high temperature storage test show that pull strength of Pb free solder decreases with time less than that of Pb solder.
Keyword (in Japanese) (See Japanese page) 
(in English) Pb free solder / Hayashi’s qualification method / pull strength / High temperature storage test / / / /  
Reference Info. IEICE Tech. Rep., vol. 108, no. 433, R2008-51, pp. 43-48, Feb. 2009.
Paper # R2008-51 
Date of Issue 2009-02-13 (R, EMD) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF R2008-51 EMD2008-127 Link to ES Tech. Rep. Archives: EMD2008-127

Conference Information
Committee EMD R  
Conference Date 2009-02-20 - 2009-02-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Sumitomo Wiring Systems LTD., Head Office 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To R 
Conference Code 2009-02-EMD-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Pull strength analysis of Pb free solder at a connected point 
Sub Title (in English)  
Keyword(1) Pb free solder  
Keyword(2) Hayashi’s qualification method  
Keyword(3) pull strength  
Keyword(4) High temperature storage test  
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1st Author's Name Taku Hashiguchi  
1st Author's Affiliation Salesian Polytechnic (Salesian Polytecn.)
2nd Author's Name Yuta Nasukawa  
2nd Author's Affiliation Salesian Polytechnic (Salesian Polytecn.)
3rd Author's Name Kazunori Hiraoka  
3rd Author's Affiliation Salesian Polytechnic (Salesian Polytecn.)
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Speaker
Date Time 2009-02-20 13:45:00 
Presentation Time 25 
Registration for R 
Paper # IEICE-R2008-51,IEICE-EMD2008-127 
Volume (vol) IEICE-108 
Number (no) no.433(R), no.434(EMD) 
Page pp.43-48 
#Pages IEICE-6 
Date of Issue IEICE-R-2009-02-13,IEICE-EMD-2009-02-13 


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