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| Presentation | 2008-11-16 09:00 Prediction of resistance of electric contact with plated layer (1) -- Theoretical analyses -- Shigeru Sawada, Kaori Shimizu, Yasuhiro Hattori (AutoNetworks Technologies, Ltd.), Terutaka Tamai (Mie Univ.)  EMD2008-88 Link to ES Tech. Rep. Archives: EMD2008-88 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Electrical contacts are an important part of electrical circuits and many reliability problems are related to their failure. It is important to investigate relationship between load and contact resistance which made contact reliability. In this study, the effect of plating material and plating thickness on contact resistance was examined. The samples were constructed of a copper alloy with tin or silver plating. The resistance of the embossment shape and plane contact was measured by using a four-probe method with a load up to 40N. The relation between contact area and contact resistance is determined. As experimental result, the results show that the contact resistance depends on the indentation of the contact area. At in the same contact area, tin-plated samples have higher resistance than those that are silver-plated because of their own resistivity. The constriction resistance with a plating layer, which depends on contact area and plating thickness, is calculated by electrical field analysis in order to predict load-contact resistance. The constriction resistance with plating is shown by R=Φρ/2a, using a surface resistance coefficient Φ theoretically. The theoretical results show good agreement with experimental results in the case of silver plating. In the case of tin plating, the experimental results are slightly higher than the theoretical results due to tin oxide film resistance effects. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Electrical contact / contact resistance / plating / contact load / contact area / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 108, no. 296, EMD2008-88, pp. 93-96, Nov. 2008. | |
| Paper # | EMD2008-88 | |
| Date of Issue | 2008-11-08 (EMD) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | EMD2008-88 Link to ES Tech. Rep. Archives: EMD2008-88 |
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| Conference Information | |
| Committee | EMD |
| Conference Date | 2008-11-15 - 2008-11-16 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Tohoku Bunka Gakuin University (Sendai) |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | International Session on Electro-Mechanical Devices 2008 |
| Paper Information | |
| Registration To | EMD |
| Conference Code | 2008-11-EMD |
| Language | English (Japanese title is available) |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Prediction of resistance of electric contact with plated layer (1) |
| Sub Title (in English) | Theoretical analyses |
| Keyword(1) | Electrical contact |
| Keyword(2) | contact resistance |
| Keyword(3) | plating |
| Keyword(4) | contact load |
| Keyword(5) | contact area |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Shigeru Sawada |
| 1st Author's Affiliation | AutoNetworks Technologies, Ltd. (AutoNetworks Technologies, Ltd.) |
| 2nd Author's Name | Kaori Shimizu |
| 2nd Author's Affiliation | AutoNetworks Technologies, Ltd. (AutoNetworks Technologies, Ltd.) |
| 3rd Author's Name | Yasuhiro Hattori |
| 3rd Author's Affiliation | AutoNetworks Technologies, Ltd. (AutoNetworks Technologies, Ltd.) |
| 4th Author's Name | Terutaka Tamai |
| 4th Author's Affiliation | Mie University (Mie Univ.) |
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| Speaker | Author-1 |
| Date Time | 2008-11-16 09:00:00 |
| Presentation Time | 20 minutes |
| Registration for | EMD |
| Paper # | EMD2008-88 |
| Volume (vol) | vol.108 |
| Number (no) | no.296 |
| Page | pp.93-96 |
| #Pages | 4 |
| Date of Issue | 2008-11-08 (EMD) |
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