Paper Abstract and Keywords |
Presentation |
2008-11-15 17:40
The Numerical Thermal Analysis for Electromechanical Relay Li Zhenbiao, Zheng Bicheng, He Zhengjie (Huazhong Univ. of Science & Tech.), Makoto Hasegawa (Chitose Inst. of Science Tech.) EMD2008-85 Link to ES Tech. Rep. Archives: EMD2008-85 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
The thermal analysis is becoming more and more important with the development of miniaturization of electromechanical relay. In this paper the transient temperature field in the selected relay was simulated at the switching operation duration 3s on and 3s off, and the effect of convection and radiation are studied. The result shows that convection and radiation have little effect on temperature rise in short time (less operations) but become more and more important with the heating time going. Convection is more effective for temperature change than radiation |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Relay / Transient Temperature Field / Heat Conduction / Radiation / Convection / / / |
Reference Info. |
IEICE Tech. Rep., vol. 108, no. 296, EMD2008-85, pp. 81-84, Nov. 2008. |
Paper # |
EMD2008-85 |
Date of Issue |
2008-11-08 (EMD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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Download PDF |
EMD2008-85 Link to ES Tech. Rep. Archives: EMD2008-85 |