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Paper Abstract and Keywords
Presentation 2008-11-15 17:40
The Numerical Thermal Analysis for Electromechanical Relay
Li Zhenbiao, Zheng Bicheng, He Zhengjie (Huazhong Univ. of Science & Tech.), Makoto Hasegawa (Chitose Inst. of Science Tech.) EMD2008-85 Link to ES Tech. Rep. Archives: EMD2008-85
Abstract (in Japanese) (See Japanese page) 
(in English) The thermal analysis is becoming more and more important with the development of miniaturization of electromechanical relay. In this paper the transient temperature field in the selected relay was simulated at the switching operation duration 3s on and 3s off, and the effect of convection and radiation are studied. The result shows that convection and radiation have little effect on temperature rise in short time (less operations) but become more and more important with the heating time going. Convection is more effective for temperature change than radiation
Keyword (in Japanese) (See Japanese page) 
(in English) Relay / Transient Temperature Field / Heat Conduction / Radiation / Convection / / /  
Reference Info. IEICE Tech. Rep., vol. 108, no. 296, EMD2008-85, pp. 81-84, Nov. 2008.
Paper # EMD2008-85 
Date of Issue 2008-11-08 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2008-85 Link to ES Tech. Rep. Archives: EMD2008-85

Conference Information
Committee EMD  
Conference Date 2008-11-15 - 2008-11-16 
Place (in Japanese) (See Japanese page) 
Place (in English) Tohoku Bunka Gakuin University (Sendai) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) International Session on Electro-Mechanical Devices 2008 
Paper Information
Registration To EMD 
Conference Code 2008-11-EMD 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) The Numerical Thermal Analysis for Electromechanical Relay 
Sub Title (in English)  
Keyword(1) Relay  
Keyword(2) Transient Temperature Field  
Keyword(3) Heat Conduction  
Keyword(4) Radiation  
Keyword(5) Convection  
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1st Author's Name Li Zhenbiao  
1st Author's Affiliation Huazhong University of Science & Technology (Huazhong Univ. of Science & Tech.)
2nd Author's Name Zheng Bicheng  
2nd Author's Affiliation Huazhong University of Science & Technology (Huazhong Univ. of Science & Tech.)
3rd Author's Name He Zhengjie  
3rd Author's Affiliation Huazhong University of Science & Technology (Huazhong Univ. of Science & Tech.)
4th Author's Name Makoto Hasegawa  
4th Author's Affiliation Chitose Institute of Science and Technology (Chitose Inst. of Science Tech.)
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Speaker Author-4 
Date Time 2008-11-15 17:40:00 
Presentation Time 20 minutes 
Registration for EMD 
Paper # EMD2008-85 
Volume (vol) vol.108 
Number (no) no.296 
Page pp.81-84 
#Pages
Date of Issue 2008-11-08 (EMD) 


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