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Paper Abstract and Keywords
Presentation 2008-07-18 11:20
[Invited Talk] Problems and Prospect of 3D Integration using Wireless and Optical Interconnection Technologies
Atsushi Iwata, Shin Yokoyama (Hiroshima Univ.) SDM2008-143 ICD2008-53 Link to ES Tech. Rep. Archives: SDM2008-143 ICD2008-53
Abstract (in Japanese) (See Japanese page) 
(in English) n 3-D integration technology which aims to enhance integration scale and performance, chip-to-chip interconnection is the most important issue. At present, 3-D integration using trough Si via (TSV) are intensively developed targeting a large capacity memory. However, problems in testing and heat spread are not resolved. For 20 years, 3-D integration using optical interconnect has been studied. Recently, inductor coupling, capacitor coupling and antenna coupling have been studied to realize higher data rate with lower power dissipation comparing with the TSV method. If system is designed with sufficient noise margin, reliability of wireless interconnections does not degrade comparing with vias. In the future, these interconnections are combined and introduced to 3-D integration utilizing each features.
Keyword (in Japanese) (See Japanese page) 
(in English) trough silicon via / optical interconnection / inductor coupling / capacitor coupling / radio wave cupling / / /  
Reference Info. IEICE Tech. Rep., vol. 108, no. 140, ICD2008-53, pp. 89-94, July 2008.
Paper # ICD2008-53 
Date of Issue 2008-07-10 (SDM, ICD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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Conference Information
Committee ICD SDM  
Conference Date 2008-07-17 - 2008-07-18 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To ICD 
Conference Code 2008-07-ICD-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Problems and Prospect of 3D Integration using Wireless and Optical Interconnection Technologies 
Sub Title (in English)  
Keyword(1) trough silicon via  
Keyword(2) optical interconnection  
Keyword(3) inductor coupling  
Keyword(4) capacitor coupling  
Keyword(5) radio wave cupling  
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1st Author's Name Atsushi Iwata  
1st Author's Affiliation Hiroshima University (Hiroshima Univ.)
2nd Author's Name Shin Yokoyama  
2nd Author's Affiliation Hiroshima University (Hiroshima Univ.)
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Speaker Author-1 
Date Time 2008-07-18 11:20:00 
Presentation Time 50 minutes 
Registration for ICD 
Paper # SDM2008-143, ICD2008-53 
Volume (vol) vol.108 
Number (no) no.139(SDM), no.140(ICD) 
Page pp.89-94 
#Pages
Date of Issue 2008-07-10 (SDM, ICD) 


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