Paper Abstract and Keywords |
Presentation |
2008-07-18 11:20
[Invited Talk]
Problems and Prospect of 3D Integration using Wireless and Optical Interconnection Technologies Atsushi Iwata, Shin Yokoyama (Hiroshima Univ.) SDM2008-143 ICD2008-53 Link to ES Tech. Rep. Archives: SDM2008-143 ICD2008-53 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
n 3-D integration technology which aims to enhance integration scale and performance, chip-to-chip interconnection is the most important issue. At present, 3-D integration using trough Si via (TSV) are intensively developed targeting a large capacity memory. However, problems in testing and heat spread are not resolved. For 20 years, 3-D integration using optical interconnect has been studied. Recently, inductor coupling, capacitor coupling and antenna coupling have been studied to realize higher data rate with lower power dissipation comparing with the TSV method. If system is designed with sufficient noise margin, reliability of wireless interconnections does not degrade comparing with vias. In the future, these interconnections are combined and introduced to 3-D integration utilizing each features. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
trough silicon via / optical interconnection / inductor coupling / capacitor coupling / radio wave cupling / / / |
Reference Info. |
IEICE Tech. Rep., vol. 108, no. 140, ICD2008-53, pp. 89-94, July 2008. |
Paper # |
ICD2008-53 |
Date of Issue |
2008-07-10 (SDM, ICD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
SDM2008-143 ICD2008-53 Link to ES Tech. Rep. Archives: SDM2008-143 ICD2008-53 |
Conference Information |
Committee |
ICD SDM |
Conference Date |
2008-07-17 - 2008-07-18 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Kikai-Shinko-Kaikan Bldg. |
Topics (in Japanese) |
(See Japanese page) |
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Paper Information |
Registration To |
ICD |
Conference Code |
2008-07-ICD-SDM |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Problems and Prospect of 3D Integration using Wireless and Optical Interconnection Technologies |
Sub Title (in English) |
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trough silicon via |
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optical interconnection |
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inductor coupling |
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capacitor coupling |
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radio wave cupling |
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1st Author's Name |
Atsushi Iwata |
1st Author's Affiliation |
Hiroshima University (Hiroshima Univ.) |
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Shin Yokoyama |
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Hiroshima University (Hiroshima Univ.) |
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Speaker |
Author-1 |
Date Time |
2008-07-18 11:20:00 |
Presentation Time |
50 minutes |
Registration for |
ICD |
Paper # |
SDM2008-143, ICD2008-53 |
Volume (vol) |
vol.108 |
Number (no) |
no.139(SDM), no.140(ICD) |
Page |
pp.89-94 |
#Pages |
6 |
Date of Issue |
2008-07-10 (SDM, ICD) |
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