講演抄録/キーワード |
講演名 |
2008-07-09 12:05
Properties of GaN MIS Capacitors Using Al2O3 as Gate Dielectric Deposited by Remote Plasma Atomic Layer Deposition ○Hyeong-Seon Yun・Ka-Lam Kim・No-Won Kwak・Woo-Seok Lee・Sang-Hyun Jeong(Cheongju Univ.)・Ju-Ok Seo(Itswell)・Kwang-Ho Kim(Cheongju Univ.) ED2008-42 SDM2008-61 エレソ技報アーカイブへのリンク:ED2008-42 SDM2008-61 |
抄録 |
(和) |
Al2O3 thin films were deposited on GaN 0001) by Remote Plasma Atomic Layer Deposition (RPALD) technique using Trimethylaluminum (TMA)precursor and oxygen radicals in the temperature range of 25「ヲ500 。ノ. Growth rate per cycle was varied with substrate temperature from 1.8 。ハ/cycle at 25 。ノ to 0.8 。ハ/cycle at 500 。ノ. Excellent electrical properties of GaN MIS capacitor were obtained at 300。ノ, in terms of low electrical leakage current density (~ 10-10 A/cm2 at 1MV) at room temperature, high dielectric constant of 8.6 with the thinner oxide thickness of 12nm. Interface trap density (Dit) was estimated using high Frequency C-V method at 300 。ノ. These results show that RPALD technique is an excellent choice to deposit high quality Al2O3 as a gate dielectric in GaN based devices. |
(英) |
Al2O3 thin films were deposited on GaN 0001) by Remote Plasma Atomic Layer Deposition (RPALD) technique using Trimethylaluminum (TMA)precursor and oxygen radicals in the temperature range of 25「ヲ500 。ノ. Growth rate per cycle was varied with substrate temperature from 1.8 。ハ/cycle at 25 。ノ to 0.8 。ハ/cycle at 500 。ノ. Excellent electrical properties of GaN MIS capacitor were obtained at 300。ノ, in terms of low electrical leakage current density (~ 10-10 A/cm2 at 1MV) at room temperature, high dielectric constant of 8.6 with the thinner oxide thickness of 12nm. Interface trap density (Dit) was estimated using high Frequency C-V method at 300 。ノ. These results show that RPALD technique is an excellent choice to deposit high quality Al2O3 as a gate dielectric in GaN based devices. |
キーワード |
(和) |
Remote Plasma Atomic Layer Deposition (RPALD) / TMA / Aluminum oxide / GaN MIS capacitor / Interface trap density / / / |
(英) |
Remote Plasma Atomic Layer Deposition (RPALD) / TMA / Aluminum oxide / GaN MIS capacitor / Interface trap density / / / |
文献情報 |
信学技報, vol. 108, no. 122, SDM2008-61, pp. 15-19, 2008年7月. |
資料番号 |
SDM2008-61 |
発行日 |
2008-07-02 (ED, SDM) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
著作権に ついて |
技術研究報告に掲載された論文の著作権は電子情報通信学会に帰属します.(許諾番号:10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
PDFダウンロード |
ED2008-42 SDM2008-61 エレソ技報アーカイブへのリンク:ED2008-42 SDM2008-61 |