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| Presentation | 2008-01-18 14:55 Chip Thinning Technologies Realizing High Chip Strength Shinya Takyu, Tetsuya Kurosawa, Noriko Shimizu, Susumu Harada (Toshiba Co.)  CPM2007-145 ICD2007-156 Link to ES Tech. Rep. Archives: CPM2007-145 ICD2007-156 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Accompanying the rapid progress of the digital network information society, there is strong demand for high functionality and miniaturization of mobile personal digital assistance. The realization of chip thickness under 50 um is demanded. However, the chip bending force is decayed dramatically as the decay of chip thickness. Wafers are thinned by means of mechanical in-feed grinding using a grindstone containing diamond particles, so there are spiral grinding saw marks on the backside of the wafer. Dicing wafers always causes surface chipping, dicing saw mark on chip side and backside chipping. These damages remained on chip faces become source of cracks, as a result chip strength decrease. In this paper, novel wafer dicing and thinning technologies that realize the average of chip strength has increased from 253 MPa to 1903 MPa are described. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Thin chip / Backside Grinding / Dicing / Dicing Before Grinding / Cleaving / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 107, no. 425, CPM2007-145, pp. 99-103, Jan. 2008. | |
| Paper # | CPM2007-145 | |
| Date of Issue | 2008-01-10 (CPM, ICD) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | CPM2007-145 ICD2007-156 Link to ES Tech. Rep. Archives: CPM2007-145 ICD2007-156 |
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| Conference Information | |
| Committee | CPM ICD |
| Conference Date | 2008-01-17 - 2008-01-18 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | CPM |
| Conference Code | 2008-01-CPM-ICD |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Chip Thinning Technologies Realizing High Chip Strength |
| Sub Title (in English) | |
| Keyword(1) | Thin chip |
| Keyword(2) | Backside Grinding |
| Keyword(3) | Dicing |
| Keyword(4) | Dicing Before Grinding |
| Keyword(5) | Cleaving |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Shinya Takyu |
| 1st Author's Affiliation | Toshiba Corporation Semiconductor Company (Toshiba Co.) |
| 2nd Author's Name | Tetsuya Kurosawa |
| 2nd Author's Affiliation | Toshiba Corporation Semiconductor Company (Toshiba Co.) |
| 3rd Author's Name | Noriko Shimizu |
| 3rd Author's Affiliation | Toshiba Corporation Semiconductor Company (Toshiba Co.) |
| 4th Author's Name | Susumu Harada |
| 4th Author's Affiliation | Toshiba Corporation Semiconductor Company (Toshiba Co.) |
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| Speaker | Author-1 |
| Date Time | 2008-01-18 14:55:00 |
| Presentation Time | 25 minutes |
| Registration for | CPM |
| Paper # | CPM2007-145, ICD2007-156 |
| Volume (vol) | vol.107 |
| Number (no) | no.425(CPM), no.426(ICD) |
| Page | pp.99-103 |
| #Pages | 5 |
| Date of Issue | 2008-01-10 (CPM, ICD) |
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