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Paper Abstract and Keywords
Presentation 2008-01-17 13:25
Fully Integrated HBT MMIC Power Amplifier Modules for Use in 2.5/3.5-GHz-Band WiMAX Applications
Miyo Miyashita, Toshio Okuda, Hitoshi Kurusu (MELCO), Shoichi Shimamura, Shinsuke Konishi (WTI), Junichi Udomoto, Ryo Matsushita, Yoshinobu Sasaki, Satoshi Suzuki, Takeshi Miura (MELCO), Yoshio Takahara (RSE), Makio Komaru, Kazuya Yamamoto (MELCO) ED2007-220 MW2007-151 Link to ES Tech. Rep. Archives: ED2007-220 MW2007-151
Abstract (in Japanese) (See Japanese page) 
(in English) This paper describes two GaAs HBT MMIC power amplifier modules (PAs) for 2.5-GHz- and 3.5-GHz-band WiMAX applications. Each amplifier module integrates a fully 50-Ω input/output matched three-stage amplifier, a 0/20-dB step attenuator, an attenuator controller, and an RF detector together with all bias circuits, featuring on-module full integration. The step attenuator operating with high power handling capability, low-distortion, and low-bias current is placed between the first and second stages, thereby suppressing the change of the input return loss between thru and attenuation modes.
With the 4.5 mm x 4.5 mm small-size module, optimized circuit design approaches lead to the following good measurement results under the 6-V supply voltage and WiMAX modulation (64QAM) test condition. The 2.5-GHz-band PA is capable of delivering a high gain (Gp) of over 31.9 dB, EVM of less than 2.1%, and PAE of more than 13.4% at a 28-dBm high output power (Pout). For the 3.5-GHz-band PA, a high Gp of over 28.1 dB, EVM of less than 2.4%, and PAE of over 11% are achieved at a Pout of 28 dBm.
Keyword (in Japanese) (See Japanese page) 
(in English) MMIC / power amplifiers (PAs) / attenuator / detector / heterojunction bipolar transistors (HBTs) / WiMAX / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 420, ED2007-220, pp. 77-82, Jan. 2008.
Paper # ED2007-220 
Date of Issue 2008-01-09 (ED, MW) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF ED2007-220 MW2007-151 Link to ES Tech. Rep. Archives: ED2007-220 MW2007-151

Conference Information
Committee ED MW  
Conference Date 2008-01-16 - 2008-01-18 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Compound Semiconductor IC, High-speed and high-frequency devices 
Paper Information
Registration To ED 
Conference Code 2008-01-ED-MW 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Fully Integrated HBT MMIC Power Amplifier Modules for Use in 2.5/3.5-GHz-Band WiMAX Applications 
Sub Title (in English)  
Keyword(1) MMIC  
Keyword(2) power amplifiers (PAs)  
Keyword(3) attenuator  
Keyword(4) detector  
Keyword(5) heterojunction bipolar transistors (HBTs)  
Keyword(6) WiMAX  
Keyword(7)  
Keyword(8)  
1st Author's Name Miyo Miyashita  
1st Author's Affiliation Mitsubishi Electric Corporation (MELCO)
2nd Author's Name Toshio Okuda  
2nd Author's Affiliation Mitsubishi Electric Corporation (MELCO)
3rd Author's Name Hitoshi Kurusu  
3rd Author's Affiliation Mitsubishi Electric Corporation (MELCO)
4th Author's Name Shoichi Shimamura  
4th Author's Affiliation Wave Technology, Inc. (WTI)
5th Author's Name Shinsuke Konishi  
5th Author's Affiliation Wave Technology, Inc. (WTI)
6th Author's Name Junichi Udomoto  
6th Author's Affiliation Mitsubishi Electric Corporation (MELCO)
7th Author's Name Ryo Matsushita  
7th Author's Affiliation Mitsubishi Electric Corporation (MELCO)
8th Author's Name Yoshinobu Sasaki  
8th Author's Affiliation Mitsubishi Electric Corporation (MELCO)
9th Author's Name Satoshi Suzuki  
9th Author's Affiliation Mitsubishi Electric Corporation (MELCO)
10th Author's Name Takeshi Miura  
10th Author's Affiliation Mitsubishi Electric Corporation (MELCO)
11th Author's Name Yoshio Takahara  
11th Author's Affiliation Renesas Semiconductor Engineering (RSE)
12th Author's Name Makio Komaru  
12th Author's Affiliation Mitsubishi Electric Corporation (MELCO)
13th Author's Name Kazuya Yamamoto  
13th Author's Affiliation Mitsubishi Electric Corporation (MELCO)
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Speaker
Date Time 2008-01-17 13:25:00 
Presentation Time 25 
Registration for ED 
Paper # IEICE-ED2007-220,IEICE-MW2007-151 
Volume (vol) IEICE-107 
Number (no) no.420(ED), no.421(MW) 
Page pp.77-82 
#Pages IEICE-6 
Date of Issue IEICE-ED-2008-01-09,IEICE-MW-2008-01-09 


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