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| Presentation | 2007-12-21 15:55 Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards (2nd Report) Tomokatsu Aizawa (Tokyo Metropolitan College), Kenichi Hanazaki (Yazaki Corporation), Keigo Okagawa (Tokyo Metropolitan College)  EMD2007-106 Link to ES Tech. Rep. Archives: EMD2007-106 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | This paper describes a new welding technique for copper foils on flexible printed circuit boards and its experimental results. When an impulse current from a capacitor bank passes through a flat one-turn coil, a magnetic flux is suddenly generated in the coil. Eddy currents are induced in overlapped copper foils on the boards placed on an insulated aluminum sheet and the coil. The foils have a gap between them. The foils can be welded both by the Joule heat generated in them and by the impact effect with pulsed magnetic pressure applied to them. The bank energy required for this welding is less than 1.2 kJ. |
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| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Flexible printed circuit board / Pressure welding / Magnetic pulse welding / Magnetic pressure / Copper foil / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 107, no. 408, EMD2007-106, pp. 35-38, Dec. 2007. | |
| Paper # | EMD2007-106 | |
| Date of Issue | 2007-12-14 (EMD) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | EMD2007-106 Link to ES Tech. Rep. Archives: EMD2007-106 |
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| Conference Information | |
| Committee | EMD |
| Conference Date | 2007-12-21 - 2007-12-21 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Japan Aviation Electronics Industry,Limited |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | EMD |
| Conference Code | 2007-12-EMD |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards (2nd Report) |
| Sub Title (in English) | |
| Keyword(1) | Flexible printed circuit board |
| Keyword(2) | Pressure welding |
| Keyword(3) | Magnetic pulse welding |
| Keyword(4) | Magnetic pressure |
| Keyword(5) | Copper foil |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Tomokatsu Aizawa |
| 1st Author's Affiliation | Tokyo Metropolitan College of Technology (Tokyo Metropolitan College) |
| 2nd Author's Name | Kenichi Hanazaki |
| 2nd Author's Affiliation | Yazaki Corporation (Yazaki Corporation) |
| 3rd Author's Name | Keigo Okagawa |
| 3rd Author's Affiliation | Tokyo Metropolitan College of Technology (Tokyo Metropolitan College) |
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| Speaker | Author-1 |
| Date Time | 2007-12-21 15:55:00 |
| Presentation Time | 25 minutes |
| Registration for | EMD |
| Paper # | EMD2007-106 |
| Volume (vol) | vol.107 |
| Number (no) | no.408 |
| Page | pp.35-38 |
| #Pages | 4 |
| Date of Issue | 2007-12-14 (EMD) |
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