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Paper Abstract and Keywords
Presentation 2007-12-21 15:55
Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards (2nd Report)
Tomokatsu Aizawa (Tokyo Metropolitan College), Kenichi Hanazaki (Yazaki Corporation), Keigo Okagawa (Tokyo Metropolitan College) EMD2007-106 Link to ES Tech. Rep. Archives: EMD2007-106
Abstract (in Japanese) (See Japanese page) 
(in English) This paper describes a new welding technique for copper foils on
flexible printed circuit boards and its experimental results. When an
impulse current from a capacitor bank passes through a flat one-turn
coil, a magnetic flux is suddenly generated in the coil. Eddy currents
are induced in overlapped copper foils on the boards placed on an
insulated aluminum sheet and the coil. The foils have a gap between
them. The foils can be welded both by the Joule heat generated in them
and by the impact effect with pulsed magnetic pressure applied to them.
The bank energy required for this welding is less than 1.2 kJ.
Keyword (in Japanese) (See Japanese page) 
(in English) Flexible printed circuit board / Pressure welding / Magnetic pulse welding / Magnetic pressure / Copper foil / / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 408, EMD2007-106, pp. 35-38, Dec. 2007.
Paper # EMD2007-106 
Date of Issue 2007-12-14 (EMD) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2007-106 Link to ES Tech. Rep. Archives: EMD2007-106

Conference Information
Committee EMD  
Conference Date 2007-12-21 - 2007-12-21 
Place (in Japanese) (See Japanese page) 
Place (in English) Japan Aviation Electronics Industry,Limited 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMD 
Conference Code 2007-12-EMD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards (2nd Report) 
Sub Title (in English)  
Keyword(1) Flexible printed circuit board  
Keyword(2) Pressure welding  
Keyword(3) Magnetic pulse welding  
Keyword(4) Magnetic pressure  
Keyword(5) Copper foil  
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1st Author's Name Tomokatsu Aizawa  
1st Author's Affiliation Tokyo Metropolitan College of Technology (Tokyo Metropolitan College)
2nd Author's Name Kenichi Hanazaki  
2nd Author's Affiliation Yazaki Corporation (Yazaki Corporation)
3rd Author's Name Keigo Okagawa  
3rd Author's Affiliation Tokyo Metropolitan College of Technology (Tokyo Metropolitan College)
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Speaker
Date Time 2007-12-21 15:55:00 
Presentation Time 25 
Registration for EMD 
Paper # IEICE-EMD2007-106 
Volume (vol) IEICE-107 
Number (no) no.408 
Page pp.35-38 
#Pages IEICE-4 
Date of Issue IEICE-EMD-2007-12-14 


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