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Paper Abstract and Keywords
Presentation 2007-12-14 16:20
Bevel mesa combined with implanted junction termination structure for 10 kV SiC PiN diodes
Toru Hiyoshi (Kyoto Univ.), Tsutomu Hori (Hitachi), Jun Suda, Tsunenobu Kimoto (Kyoto Univ.) SDM2007-233 Link to ES Tech. Rep. Archives: SDM2007-233
Abstract (in Japanese) (See Japanese page) 
(in English) A 10 kV 4H-SiC PiN diode with an improved junction termination structure has been fabricated. A mesa structure was formed by reactive ion etching (RIE) with a ${\rm SiO_2}$ mask. An improved bevel mesa structure has a nearly vertical side-wall at the edge of pn junction and a rounded corner at mesa bottom. Thick ${\rm n^{-}}$-drift layers (concentration: ${\rm 3~7\times 10^{14}\ cm^{-3}}$, thickness: 90~100 ${\rm \mu m}$) have been formed by horizontal hot-wall CVD with a high growth rate of 45 ${\rm \mu m}$. The p-anode and junction termination extension (JTE) region were formed by Al ion implantation. The JTE dose and JTE width have been optimized by device simulation. Simulated breakdown voltage has been compared with experimental results. The locations of electric field crowding and diode breakdown have been also discussed. A PiN diode with improved bevel mesa structure and optimum JTE dose exhibited a high blocking voltage of 10.2 kV.
Keyword (in Japanese) (See Japanese page) 
(in English) Silicon carbide / PiN / Bevel mesa / JTE / Device simulation / / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 388, SDM2007-233, pp. 47-50, Dec. 2007.
Paper # SDM2007-233 
Date of Issue 2007-12-07 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2007-233 Link to ES Tech. Rep. Archives: SDM2007-233

Conference Information
Committee SDM  
Conference Date 2007-12-14 - 2007-12-14 
Place (in Japanese) (See Japanese page) 
Place (in English) Nara Institute Science and Technology 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Silicon related material, process and device 
Paper Information
Registration To SDM 
Conference Code 2007-12-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Bevel mesa combined with implanted junction termination structure for 10 kV SiC PiN diodes 
Sub Title (in English)  
Keyword(1) Silicon carbide  
Keyword(2) PiN  
Keyword(3) Bevel mesa  
Keyword(4) JTE  
Keyword(5) Device simulation  
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1st Author's Name Toru Hiyoshi  
1st Author's Affiliation Kyoto University (Kyoto Univ.)
2nd Author's Name Tsutomu Hori  
2nd Author's Affiliation Hitachi Metals, Ltd. (Hitachi)
3rd Author's Name Jun Suda  
3rd Author's Affiliation Kyoto University (Kyoto Univ.)
4th Author's Name Tsunenobu Kimoto  
4th Author's Affiliation Kyoto University (Kyoto Univ.)
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Speaker Author-1 
Date Time 2007-12-14 16:20:00 
Presentation Time 20 minutes 
Registration for SDM 
Paper # SDM2007-233 
Volume (vol) vol.107 
Number (no) no.388 
Page pp.47-50 
#Pages
Date of Issue 2007-12-07 (SDM) 


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