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Paper Abstract and Keywords
Presentation 2007-08-23 15:35
Fundamental Analysis of Coupling Efficiency and DMD for High-speed Board and Chip Level Optical Interconnects
Yoshitsugu Wakazono, Atsushi Suzuki, Daisuke Nagao, Takaaki Ishikawa, Tomoyuki Hino, Yoichi Hashimoto, Hiroshi Masuda, Shuji Suzuki, Mitsuaki Tamura, Teiichi Suzuki, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi, Takashi Mikawa (AIST) EMD2007-38 CPM2007-59 OPE2007-76 LQE2007-39 Link to ES Tech. Rep. Archives: EMD2007-38 CPM2007-59 OPE2007-76 LQE2007-39
Abstract (in Japanese) (See Japanese page) 
(in English) We evaluated coupling efficiency between VCSEL and optical components and DMD(Differential Mode Delay) as a fundamental analysis for high-speed board and chip level optical interconnects. In this paper, we analyzed the coupling efficiency between VCSEL and the upper component with high-delta fibers experimentally to confirm the concept of VGPAS. The 1dB tolerance of the upper component was +/-20um. The upper components were suitable for low-cost optical interconnection modules. This measurement supported the performance of our module on the concepts of VGPAS. Additionally, we calculated DMD to evaluate the transmission performance of the rectangular optical waveguide numerically in consideration of the coupling efficiency of all modes. We revealed that DMD was less than 1ps/m and it was small enough to apply 1m-long optical waveguide for 10Gbps transmission at 0.85um wavelength when core size of optical waveguide was over 60 um square and refractive index of core was 1.5 with refractive index difference of 2.0%.
Keyword (in Japanese) (See Japanese page) 
(in English) O/E transceiver module / coupling efficiency / DMD / / / / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 197, CPM2007-59, pp. 49-54, Aug. 2007.
Paper # CPM2007-59 
Date of Issue 2007-08-16 (EMD, CPM, OPE, LQE) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2007-38 CPM2007-59 OPE2007-76 LQE2007-39 Link to ES Tech. Rep. Archives: EMD2007-38 CPM2007-59 OPE2007-76 LQE2007-39

Conference Information
Committee CPM LQE OPE EMD  
Conference Date 2007-08-23 - 2007-08-24 
Place (in Japanese) (See Japanese page) 
Place (in English) Hokaido Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To CPM 
Conference Code 2007-08-CPM-LQE-OPE-EMD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Fundamental Analysis of Coupling Efficiency and DMD for High-speed Board and Chip Level Optical Interconnects 
Sub Title (in English)  
Keyword(1) O/E transceiver module  
Keyword(2) coupling efficiency  
Keyword(3) DMD  
Keyword(4)  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Yoshitsugu Wakazono  
1st Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
2nd Author's Name Atsushi Suzuki  
2nd Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
3rd Author's Name Daisuke Nagao  
3rd Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
4th Author's Name Takaaki Ishikawa  
4th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
5th Author's Name Tomoyuki Hino  
5th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
6th Author's Name Yoichi Hashimoto  
6th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
7th Author's Name Hiroshi Masuda  
7th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
8th Author's Name Shuji Suzuki  
8th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
9th Author's Name Mitsuaki Tamura  
9th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
10th Author's Name Teiichi Suzuki  
10th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
11th Author's Name Katsuya Kikuchi  
11th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
12th Author's Name Hiroshi Nakagawa  
12th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
13th Author's Name Masahiro Aoyagi  
13th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
14th Author's Name Takashi Mikawa  
14th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
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Speaker
Date Time 2007-08-23 15:35:00 
Presentation Time 25 
Registration for CPM 
Paper # IEICE-EMD2007-38,IEICE-CPM2007-59,IEICE-OPE2007-76,IEICE-LQE2007-39 
Volume (vol) IEICE-107 
Number (no) no.196(EMD), no.197(CPM), no.198(OPE), no.199(LQE) 
Page pp.49-54 
#Pages IEICE-6 
Date of Issue IEICE-EMD-2007-08-16,IEICE-CPM-2007-08-16,IEICE-OPE-2007-08-16,IEICE-LQE-2007-08-16 


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