Paper Abstract and Keywords |
Presentation |
2007-08-23 15:10
Development of chi-to-chip optical interconnection technology forsuper-high-performance computers Mikio Oda, Hikaru Kouta (NEC) EMD2007-37 CPM2007-58 OPE2007-75 LQE2007-38 Link to ES Tech. Rep. Archives: EMD2007-37 CPM2007-58 OPE2007-75 LQE2007-38 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
Electrical signals on substrates became faster as LSI signals became faster. Optical signals, which can transmit faster data than electrical signals, are necessary for LSI-to-LSI interconnection. Because there are limitations of high-speed and high-density electrical signals. It is important that LSI closely cooperates with optical interconnection technologies and become a package including optical interfaces. In order to realize LSI-to-LSI optical transmission, we developed super-high-density substrates and packaging technologies for optical modules. We succeeded to transmit 10 Gbps optical signals between 10 Gbps LSIs. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
High performance LSI / Limitation of high speed and density of electrical circuits / LSI-to-LSI interconnection by optical signals / Super-high-density substrate for optical modules / 10 Gbps optical transmission / / / |
Reference Info. |
IEICE Tech. Rep., vol. 107, no. 198, OPE2007-75, pp. 45-48, Aug. 2007. |
Paper # |
OPE2007-75 |
Date of Issue |
2007-08-16 (EMD, CPM, OPE, LQE) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
EMD2007-37 CPM2007-58 OPE2007-75 LQE2007-38 Link to ES Tech. Rep. Archives: EMD2007-37 CPM2007-58 OPE2007-75 LQE2007-38 |
Conference Information |
Committee |
CPM LQE OPE EMD |
Conference Date |
2007-08-23 - 2007-08-24 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Hokaido Univ. |
Topics (in Japanese) |
(See Japanese page) |
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Paper Information |
Registration To |
OPE |
Conference Code |
2007-08-CPM-LQE-OPE-EMD |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Development of chi-to-chip optical interconnection technology forsuper-high-performance computers |
Sub Title (in English) |
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Keyword(1) |
High performance LSI |
Keyword(2) |
Limitation of high speed and density of electrical circuits |
Keyword(3) |
LSI-to-LSI interconnection by optical signals |
Keyword(4) |
Super-high-density substrate for optical modules |
Keyword(5) |
10 Gbps optical transmission |
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1st Author's Name |
Mikio Oda |
1st Author's Affiliation |
NEC Corporation (NEC) |
2nd Author's Name |
Hikaru Kouta |
2nd Author's Affiliation |
NEC Corporation (NEC) |
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Speaker |
Author-1 |
Date Time |
2007-08-23 15:10:00 |
Presentation Time |
25 minutes |
Registration for |
OPE |
Paper # |
EMD2007-37, CPM2007-58, OPE2007-75, LQE2007-38 |
Volume (vol) |
vol.107 |
Number (no) |
no.196(EMD), no.197(CPM), no.198(OPE), no.199(LQE) |
Page |
pp.45-48 |
#Pages |
4 |
Date of Issue |
2007-08-16 (EMD, CPM, OPE, LQE) |
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