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Paper Abstract and Keywords
Presentation 2007-08-23 15:10
Development of chi-to-chip optical interconnection technology forsuper-high-performance computers
Mikio Oda, Hikaru Kouta (NEC) EMD2007-37 CPM2007-58 OPE2007-75 LQE2007-38 Link to ES Tech. Rep. Archives: EMD2007-37 CPM2007-58 OPE2007-75 LQE2007-38
Abstract (in Japanese) (See Japanese page) 
(in English) Electrical signals on substrates became faster as LSI signals became faster. Optical signals, which can transmit faster data than electrical signals, are necessary for LSI-to-LSI interconnection. Because there are limitations of high-speed and high-density electrical signals. It is important that LSI closely cooperates with optical interconnection technologies and become a package including optical interfaces. In order to realize LSI-to-LSI optical transmission, we developed super-high-density substrates and packaging technologies for optical modules. We succeeded to transmit 10 Gbps optical signals between 10 Gbps LSIs.
Keyword (in Japanese) (See Japanese page) 
(in English) High performance LSI / Limitation of high speed and density of electrical circuits / LSI-to-LSI interconnection by optical signals / Super-high-density substrate for optical modules / 10 Gbps optical transmission / / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 198, OPE2007-75, pp. 45-48, Aug. 2007.
Paper # OPE2007-75 
Date of Issue 2007-08-16 (EMD, CPM, OPE, LQE) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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Download PDF EMD2007-37 CPM2007-58 OPE2007-75 LQE2007-38 Link to ES Tech. Rep. Archives: EMD2007-37 CPM2007-58 OPE2007-75 LQE2007-38

Conference Information
Committee CPM LQE OPE EMD  
Conference Date 2007-08-23 - 2007-08-24 
Place (in Japanese) (See Japanese page) 
Place (in English) Hokaido Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To OPE 
Conference Code 2007-08-CPM-LQE-OPE-EMD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Development of chi-to-chip optical interconnection technology forsuper-high-performance computers 
Sub Title (in English)  
Keyword(1) High performance LSI  
Keyword(2) Limitation of high speed and density of electrical circuits  
Keyword(3) LSI-to-LSI interconnection by optical signals  
Keyword(4) Super-high-density substrate for optical modules  
Keyword(5) 10 Gbps optical transmission  
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1st Author's Name Mikio Oda  
1st Author's Affiliation NEC Corporation (NEC)
2nd Author's Name Hikaru Kouta  
2nd Author's Affiliation NEC Corporation (NEC)
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Speaker Author-1 
Date Time 2007-08-23 15:10:00 
Presentation Time 25 minutes 
Registration for OPE 
Paper # EMD2007-37, CPM2007-58, OPE2007-75, LQE2007-38 
Volume (vol) vol.107 
Number (no) no.196(EMD), no.197(CPM), no.198(OPE), no.199(LQE) 
Page pp.45-48 
#Pages
Date of Issue 2007-08-16 (EMD, CPM, OPE, LQE) 


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