IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2007-06-07 14:45
Depth Profiling of Chemical Composition and Defect State Density of SiNx Formed by Plasma CVD
Masahi Miura, Akio Ohta, Hideki Murakami, Seiichiro Higashi, Seiichi Miyazaki (Hiroshima Univ.), Masayuki Kohno, Tatsuo Nishida, Toshio Nakanishi (TEL) SDM2007-34 Link to ES Tech. Rep. Archives: SDM2007-34
Abstract (in Japanese) (See Japanese page) 
(in English) The depth profiling of chemical composition and defect state density in tensile- and compressive-SiNx films formed on chemical oxide/Si(100) by plasma CVD method using Si2H6+NH3 or Si2H6+N2 gas mixture at 400ºC were evaluated by x-ray photoelectron spectroscopy (XPS) and total photoelectron yield spectroscopy (PYS) at each step of oxide thinning in a dilute HF solution. From the depth profile of chemical composition of the tensile-SiNx, which was determined from the change in XPS core line spectra at each thinning step, we have found that the oxygen content increases near the sample surface and in the region within ~3nm from Si(100) substrate. In the case of compressive-SiNx, diffusion and incorporation of oxygen atoms into the films were suppressed with an increment of the nitrogen content by ~10at.% in the film as compared to the tensile-SiNx case. The PYS analysis shows that the filled defects state density in the energy region corresponding to Si bandgap for tensile-SiNx was~2x1017cm-2eV-1 in Si midgap, being 5times larger than tensile-SiNx. From the correlation between profiles of oxygen and defect density, It is suggested that the oxygen incorporation into SiNx films within ~20 at.% is responsible for the defect generation
Keyword (in Japanese) (See Japanese page) 
(in English) SiNx film / X-ray photoelectron spectroscopy / Total photoelectron yield spectroscopy / SONOS / / / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 85, SDM2007-34, pp. 17-22, June 2007.
Paper # SDM2007-34 
Date of Issue 2007-05-31 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2007-34 Link to ES Tech. Rep. Archives: SDM2007-34

Conference Information
Committee SDM  
Conference Date 2007-06-07 - 2007-06-08 
Place (in Japanese) (See Japanese page) 
Place (in English) Hiroshima Univ. ( Faculty Club) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Sci. & Technol. for Thin Dielectrics for MIS Devices 
Paper Information
Registration To SDM 
Conference Code 2007-06-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Depth Profiling of Chemical Composition and Defect State Density of SiNx Formed by Plasma CVD 
Sub Title (in English)  
Keyword(1) SiNx film  
Keyword(2) X-ray photoelectron spectroscopy  
Keyword(3) Total photoelectron yield spectroscopy  
Keyword(4) SONOS  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Masahi Miura  
1st Author's Affiliation Hiroshima University (Hiroshima Univ.)
2nd Author's Name Akio Ohta  
2nd Author's Affiliation Hiroshima University (Hiroshima Univ.)
3rd Author's Name Hideki Murakami  
3rd Author's Affiliation Hiroshima University (Hiroshima Univ.)
4th Author's Name Seiichiro Higashi  
4th Author's Affiliation Hiroshima University (Hiroshima Univ.)
5th Author's Name Seiichi Miyazaki  
5th Author's Affiliation Hiroshima University (Hiroshima Univ.)
6th Author's Name Masayuki Kohno  
6th Author's Affiliation TOKYO ELECTRON AT. SPA Development Engineering Dept. (TEL)
7th Author's Name Tatsuo Nishida  
7th Author's Affiliation TOKYO ELECTRON AT. SPA Development Engineering Dept. (TEL)
8th Author's Name Toshio Nakanishi  
8th Author's Affiliation TOKYO ELECTRON AT. SPA Development Engineering Dept. (TEL)
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2007-06-07 14:45:00 
Presentation Time 25 minutes 
Registration for SDM 
Paper # SDM2007-34 
Volume (vol) vol.107 
Number (no) no.85 
Page pp.17-22 
#Pages
Date of Issue 2007-05-31 (SDM) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan