IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
... (for ESS/CS/ES/ISS)
Tech. Rep. Archives
... (for ES/CS)
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2007-05-18 15:00
Development of New Molded Interconnect Device -- Innovative MID technology to realize a micro device --
Mitsuru Kobayashi (Matsushita Electric Works, Ltd.) EMD2007-9 Link to ES Tech. Rep. Archives: EMD2007-9
Abstract (in Japanese) (See Japanese page) 
(in English) We developed Microscopic Integrated Processing Technology ("MIPTEC" for short) which enabled flip-chip mounting on a molded interconnect device (MID) in thermoplastic resin for the first time in the world.
We realized the resin materials whose CTE (coefficient of thermal expansion) and anisotropy were reduced.
Furthermore, we succeeded in fusing original metallizing processing technology and micro laser-patterning method.
And we applied this technology to ceramics. Ceramics have such a characteristics as ?high heat conductivity ?low CTE
?high heat-resistant ?superior high frequency characteristic.
Keyword (in Japanese) (See Japanese page) 
(in English) MID / surface activation process / laser / thermoplastic resinbare-chip mount / / ceramics / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 46, EMD2007-9, pp. 13-16, May 2007.
Paper # EMD2007-9 
Date of Issue 2007-05-11 (EMD) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (No. 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2007-9 Link to ES Tech. Rep. Archives: EMD2007-9

Conference Information
Committee EMD  
Conference Date 2007-05-18 - 2007-05-18 
Place (in Japanese) (See Japanese page) 
Place (in English) Ishinomaki Senshu University 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMD 
Conference Code 2007-05-EMD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Development of New Molded Interconnect Device 
Sub Title (in English) Innovative MID technology to realize a micro device 
Keyword(1) MID  
Keyword(2) surface activation process  
Keyword(3) laser  
Keyword(4) thermoplastic resinbare-chip mount  
Keyword(6) ceramics  
1st Author's Name Mitsuru Kobayashi  
1st Author's Affiliation Matsushita Electric Works, Ltd. (Matsushita Electric Works, Ltd.)
2nd Author's Name  
2nd Author's Affiliation ()
3rd Author's Name  
3rd Author's Affiliation ()
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Date Time 2007-05-18 15:00:00 
Presentation Time 25 
Registration for EMD 
Paper # IEICE-EMD2007-9 
Volume (vol) IEICE-107 
Number (no) no.46 
Page pp.13-16 
#Pages IEICE-4 
Date of Issue IEICE-EMD-2007-05-11 

[Return to Top Page]

[Return to IEICE Web Page]

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan