Paper Abstract and Keywords |
Presentation |
2007-05-11 14:35
Effect of Dummy Fill on High-Frequency Characteristics of On-Chip Interconnects Akira Tsuchiya, Hidetoshi Onodera (Kyoto Univ.) VLD2007-16 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
This paper reports measurement results of on-chip interconnects with CMP dummy fill.
CMP dummy fill is a floating metal for metal density adjustment.
Conventionally, the effect of dummy fill on the interconnect characteristics is discussed mainly
from the viewpoint of the capacitance.
However in high frequency above 10GHz, the eddy current induced in dummy fills affects the interconnect loss.
We fabricated test structures of on-chip interconnect with dummy fills.
From the measurement results, the effect of the dummy fills on the wire resistance
is not negligible even if the ground wires are adjacent to the signal wire.
The dummy fills in the upper/lower metal layer affect the wire resistance
and the resistance increases by 20\% at 50GHz. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
dummy fill / eddy current / / / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 107, no. 32, VLD2007-16, pp. 55-59, May 2007. |
Paper # |
VLD2007-16 |
Date of Issue |
2007-05-04 (VLD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
VLD2007-16 |
Conference Information |
Committee |
VLD IPSJ-SLDM |
Conference Date |
2007-05-10 - 2007-05-11 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Kyodai Kaikan |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
System Design, etc. |
Paper Information |
Registration To |
VLD |
Conference Code |
2007-05-VLD-IPSJ-SLDM |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Effect of Dummy Fill on High-Frequency Characteristics of On-Chip Interconnects |
Sub Title (in English) |
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dummy fill |
Keyword(2) |
eddy current |
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1st Author's Name |
Akira Tsuchiya |
1st Author's Affiliation |
Kyoto University (Kyoto Univ.) |
2nd Author's Name |
Hidetoshi Onodera |
2nd Author's Affiliation |
Kyoto University (Kyoto Univ.) |
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Speaker |
Author-1 |
Date Time |
2007-05-11 14:35:00 |
Presentation Time |
25 minutes |
Registration for |
VLD |
Paper # |
VLD2007-16 |
Volume (vol) |
vol.107 |
Number (no) |
no.32 |
Page |
pp.55-59 |
#Pages |
5 |
Date of Issue |
2007-05-04 (VLD) |
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