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Paper Abstract and Keywords
Presentation 2007-03-09 14:00
Study of Return Loss for a Test Board with Bonding Wires by FDTD Method
Hsing-Yi Chen, Chieh-Pin Su (Yuan Ze Univ.) AP2006-166
Abstract (in Japanese) (See Japanese page) 
(in English) Return losses of bonding wires fabricated on a test board for RF and microwave circuit applications are studied by the finite-difference time-domain (FDTD) method. Simulation results of return losses obtained by the FDTD method are presented and compared with those obtained by the HFSS software and measurements at frequencies of 0.04~6 GHz. It is found that simulation results calculated by the FDTD method make a good agreement with those obtained by the HFSS software. Results of the FDTD method are also further validated by the measurement data.
Keyword (in Japanese) (See Japanese page) 
(in English) Return losses / bonding wires / FDTD / / / / /  
Reference Info. IEICE Tech. Rep., vol. 106, no. 561, AP2006-166, pp. 97-100, March 2007.
Paper # AP2006-166 
Date of Issue 2007-03-01 (AP) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee AP  
Conference Date 2007-03-08 - 2007-03-09 
Place (in Japanese) (See Japanese page) 
Place (in English) Taiwan (Yuan Ze Univ.) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Antennas and Propagation 
Paper Information
Registration To AP 
Conference Code 2007-03-AP 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Study of Return Loss for a Test Board with Bonding Wires by FDTD Method 
Sub Title (in English)  
Keyword(1) Return losses  
Keyword(2) bonding wires  
Keyword(3) FDTD  
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1st Author's Name Hsing-Yi Chen  
1st Author's Affiliation Yuan Ze University (Yuan Ze Univ.)
2nd Author's Name Chieh-Pin Su  
2nd Author's Affiliation Yuan Ze University (Yuan Ze Univ.)
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Speaker Author-1 
Date Time 2007-03-09 14:00:00 
Presentation Time 20 minutes 
Registration for AP 
Paper # AP2006-166 
Volume (vol) vol.106 
Number (no) no.561 
Page pp.97-100 
#Pages
Date of Issue 2007-03-01 (AP) 


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