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Paper Abstract and Keywords
Presentation 2007-03-06 09:30
[Poster Presentation] A Study on Thermal Conduction and Distribution in Package for SiC-SBD
Tsuyoshi Funaki, Akira Nishio, Takashi Hikihara (Kyoto Univ.) CAS2006-98 SIP2006-199 CS2006-115
Abstract (in Japanese) (See Japanese page) 
(in English) Electrical characeristics of semiconductor devices vary with temperature. Thermal influence becomes more important for SiC devices, because it is expected to operate under wide temperature range. Heat generation by conduction loss and switching loss in power devices changes due to operating conditions. Therefore, it is inevitable to take the temperature dependency of characteristics of devices into account for the design of power conversion circuit. This paper models and analyzes heat conduction in SiC-SBD package with respect to current flow in electrical circuit. On the model we discuss the tenperature distribution with comparison to experimental results.
Keyword (in Japanese) (See Japanese page) 
(in English) SiC-SBD / heat conduction / thermal circuit / circuit simulator / / / /  
Reference Info. IEICE Tech. Rep., vol. 106, no. 568, CAS2006-98, pp. 29-34, March 2007.
Paper # CAS2006-98 
Date of Issue 2007-02-27 (CAS, SIP, CS) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF CAS2006-98 SIP2006-199 CS2006-115

Conference Information
Committee SIP CAS CS  
Conference Date 2007-03-05 - 2007-03-06 
Place (in Japanese) (See Japanese page) 
Place (in English) Blancart Misasa (Tottori) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Signal Processing for Communications, Code Theory, etc. 
Paper Information
Registration To CAS 
Conference Code 2007-03-SIP-CAS-CS 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Study on Thermal Conduction and Distribution in Package for SiC-SBD 
Sub Title (in English)  
Keyword(1) SiC-SBD  
Keyword(2) heat conduction  
Keyword(3) thermal circuit  
Keyword(4) circuit simulator  
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1st Author's Name Tsuyoshi Funaki  
1st Author's Affiliation Kyoto University (Kyoto Univ.)
2nd Author's Name Akira Nishio  
2nd Author's Affiliation Kyoto University (Kyoto Univ.)
3rd Author's Name Takashi Hikihara  
3rd Author's Affiliation Kyoto University (Kyoto Univ.)
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Speaker Author-2 
Date Time 2007-03-06 09:30:00 
Presentation Time 120 minutes 
Registration for CAS 
Paper # CAS2006-98, SIP2006-199, CS2006-115 
Volume (vol) vol.106 
Number (no) no.568(CAS), no.570(SIP), no.572(CS) 
Page pp.29-34 
#Pages
Date of Issue 2007-02-27 (CAS, SIP, CS) 


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