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| Presentation | 2007-01-23 14:30 Systems approaches to surface acoustic wave devices Takaya Watanabe (FT Design Lab.) Link to ES Tech. Rep. Archives:  EMD2006-65 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Surface acoustic wave devices are electronic component that united standardization with the diversification. They are the component modules that the surface acoustic wave device chip is assembled in the package and not the chip components of the units such as the chip resistances and the chip capacitors though kinds of the thin film components. There is a process of making to high performance, the high reliability of the surface acoustic wave device, and making to package-less by the improvement of the economy furthermore. Making the surface acoustic wave device package-less is a problem indispensable to which the component modules should solve. As the application example to the high performance surface acoustic wave device of making to the chip, LST-cut leaky surface acoustic wave devices and surface acoustic wave devices that used Li2B4O7 crystal are targeted in the systems approaches and examined. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | surface acoustic wave device / Rayleigh wave / leaky wave / chip components / LST-cut / Li2B4O7 / package-less / | |
| Reference Info. | IEICE Tech. Rep., vol. 106, no. 474, EMD2006-65, pp. 7-12, Jan. 2007. | |
| Paper # | EMD2006-65 | |
| Date of Issue | 2007-01-16 (EMD) | |
| ISSN | Print edition: ISSN 0913-5685 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | Link to ES Tech. Rep. Archives: EMD2006-65 |
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| Conference Information | |
| Committee | EMD |
| Conference Date | 2007-01-23 - 2007-01-23 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | EMD |
| Conference Code | 2007-01-EMD |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Systems approaches to surface acoustic wave devices |
| Sub Title (in English) | |
| Keyword(1) | surface acoustic wave device |
| Keyword(2) | Rayleigh wave |
| Keyword(3) | leaky wave |
| Keyword(4) | chip components |
| Keyword(5) | LST-cut |
| Keyword(6) | Li2B4O7 |
| Keyword(7) | package-less |
| Keyword(8) | |
| 1st Author's Name | Takaya Watanabe |
| 1st Author's Affiliation | FT Design Lab. (FT Design Lab.) |
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| Speaker | Author-1 |
| Date Time | 2007-01-23 14:30:00 |
| Presentation Time | 25 minutes |
| Registration for | EMD |
| Paper # | EMD2006-65 |
| Volume (vol) | vol.106 |
| Number (no) | no.474 |
| Page | pp.7-12 |
| #Pages | 6 |
| Date of Issue | 2007-01-16 (EMD) |
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