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| Presentation | 2007-01-19 15:45 Wid eband Decoupling Properties by the Combination of Ultra-thin Insulator and EBG Structure Seiju Ichijo (Toshiba), Takanobu Kushihira (MSC), Toshio Sudo (Toshiba) Link to ES Tech. Rep. Archives:  CPM2006-153 ICD2006-195 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Wide-band decoupling property of power/ground structure of a printed circuit board is required for the high-speed digital applications. Low S21 property with around -60 dB can be obtained by simply using thin dielectric layer of 16 um. While, the EBG (electromagnetic bandgap) structure with relatively thick dielectric layer of 500 um showed the typical stop-band property. By combining ultra-thin dielectric layer and EBG structure, low S21 property with wideband upto several GHz range has been obtained along with high isolation property of more than -80dB. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | PCB / S parameter / SSN / EMI / EBG structure / ultra-thin insulator / / | |
| Reference Info. | IEICE Tech. Rep., vol. 106, no. 467, CPM2006-153, pp. 137-142, Jan. 2007. | |
| Paper # | CPM2006-153 | |
| Date of Issue | 2007-01-11 (CPM, ICD) | |
| ISSN | Print edition: ISSN 0913-5685 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | Link to ES Tech. Rep. Archives: CPM2006-153 ICD2006-195 |
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| Conference Information | |
| Committee | ICD CPM |
| Conference Date | 2007-01-18 - 2007-01-19 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kika-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | LSI system assembly and module/inteface technology, test, general |
| Paper Information | |
| Registration To | CPM |
| Conference Code | 2007-01-ICD-CPM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Wid eband Decoupling Properties by the Combination of Ultra-thin Insulator and EBG Structure |
| Sub Title (in English) | |
| Keyword(1) | PCB |
| Keyword(2) | S parameter |
| Keyword(3) | SSN |
| Keyword(4) | EMI |
| Keyword(5) | EBG structure |
| Keyword(6) | ultra-thin insulator |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Seiju Ichijo |
| 1st Author's Affiliation | Toshiba Corp. (Toshiba) |
| 2nd Author's Name | Takanobu Kushihira |
| 2nd Author's Affiliation | Manufacturing Engineering Corp. (MSC) |
| 3rd Author's Name | Toshio Sudo |
| 3rd Author's Affiliation | Toshiba Corp. (Toshiba) |
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| Speaker | Author-3 |
| Date Time | 2007-01-19 15:45:00 |
| Presentation Time | 25 minutes |
| Registration for | CPM |
| Paper # | CPM2006-153, ICD2006-195 |
| Volume (vol) | vol.106 |
| Number (no) | no.467(CPM), no.468(ICD) |
| Page | pp.137-142 |
| #Pages | 6 |
| Date of Issue | 2007-01-11 (CPM, ICD) |
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