IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2006-11-09 17:00
Barrier properties of HfNx thin films prepared by hot wire method between Cu interconnects and SiO2 or SiOC layer
Masaru Sato, Mayumi B. Takeyama, Atsushi Noya (Kitami Inst. of Technol.) Link to ES Tech. Rep. Archives: CPM2006-121
Abstract (in Japanese) (See Japanese page) 
(in English) (Not available yet)
Keyword (in Japanese) (See Japanese page) 
(in English) / / / / / / /  
Reference Info. IEICE Tech. Rep., vol. 106, no. 336, CPM2006-121, pp. 47-52, Nov. 2006.
Paper # CPM2006-121 
Date of Issue 2006-11-02 (CPM) 
ISSN Print edition: ISSN 0913-5685
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF Link to ES Tech. Rep. Archives: CPM2006-121

Conference Information
Committee CPM  
Conference Date 2006-11-09 - 2006-11-10 
Place (in Japanese) (See Japanese page) 
Place (in English) Kanazawa Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Process of Thin Film formation and Materials, etc. 
Paper Information
Registration To CPM 
Conference Code 2006-11-CPM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Barrier properties of HfNx thin films prepared by hot wire method between Cu interconnects and SiO2 or SiOC layer 
Sub Title (in English)  
Keyword(1)  
Keyword(2)  
Keyword(3)  
Keyword(4)  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Masaru Sato  
1st Author's Affiliation Kitami-Institute of Technology (Kitami Inst. of Technol.)
2nd Author's Name Mayumi B. Takeyama  
2nd Author's Affiliation Kitami-Institute of Technology (Kitami Inst. of Technol.)
3rd Author's Name Atsushi Noya  
3rd Author's Affiliation Kitami-Institute of Technology (Kitami Inst. of Technol.)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2006-11-09 17:00:00 
Presentation Time 25 minutes 
Registration for CPM 
Paper # CPM2006-121 
Volume (vol) vol.106 
Number (no) no.336 
Page pp.47-52 
#Pages
Date of Issue 2006-11-02 (CPM) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan