IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2006-06-30 15:50
Structure and Physical Properties of Poly(di-methyl silane) and Poly(di-hexyl silane) Thin Films
Shoji Furukawa, Hidetaka Ohta, Hitoshi Arakawa, Takashi Yasuda, Akihiko Katsuki (Kyushu Inst. Technology) Link to ES Tech. Rep. Archives: EMD2006-13 CPM2006-37 OME2006-47
Abstract (in Japanese) (See Japanese page) 
(in English) Thin Films of poly(di-methyl silane) and poly(di-hexyl silane) have been prepared by the vacuum evaporation technique and casting method, respectively. And the structure and orientation of the films obtained are examined by the X-ray diffraction method. The orientation of the silicon backbone (all-trans conformation) of poly(di-methyl silane) can be controlled by changing evaporation rate, substrate temperature, and vacuum pressure during the deposition. On the other hand, poly(di-hexyl silane) is solved in organic solvent at room temperature. Therefore, poly(di-hexyl silane) thin films are fabricated by the wet process. From the X-ray diffraction measurement, it is found that the direction of the silicon backbone (all-trans conformation) of poly(di-hexyl silane) molecule is parallel to the substrate surface. The reason is discussed on the bases of the molecular structure and packing of poly(di-hexyl silane). Electrical property of the poly(di-methyl silane) thin film is also examined, and the result is discussed on the bases of the molecular structure and packing of poly(di-methyl silane).
Keyword (in Japanese) (See Japanese page) 
(in English) Poly(di-methyl silane) / Poly(di-hexyl silane) / X-ray Diffraction / Orientation / Molecular Structure / / /  
Reference Info. IEICE Tech. Rep., vol. 106, no. 132, OME2006-47, pp. 45-49, June 2006.
Paper # OME2006-47 
Date of Issue 2006-06-23 (EMD, CPM, OME) 
ISSN Print edition: ISSN 0913-5685
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF Link to ES Tech. Rep. Archives: EMD2006-13 CPM2006-37 OME2006-47

Conference Information
Committee CPM EMD OME  
Conference Date 2006-06-30 - 2006-06-30 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Piezoelectric Devices, Piezoelectric Materials, Ferroelectric Materials, Organic Electronics, etc. (ES Summer Meeting of Materials and Devices) 
Paper Information
Registration To OME 
Conference Code 2006-06-CPM-EMD-OME 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Structure and Physical Properties of Poly(di-methyl silane) and Poly(di-hexyl silane) Thin Films 
Sub Title (in English)  
Keyword(1) Poly(di-methyl silane)  
Keyword(2) Poly(di-hexyl silane)  
Keyword(3) X-ray Diffraction  
Keyword(4) Orientation  
Keyword(5) Molecular Structure  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Shoji Furukawa  
1st Author's Affiliation Kyushu Institute of Technology (Kyushu Inst. Technology)
2nd Author's Name Hidetaka Ohta  
2nd Author's Affiliation Kyushu Institute of Technology (Kyushu Inst. Technology)
3rd Author's Name Hitoshi Arakawa  
3rd Author's Affiliation Kyushu Institute of Technology (Kyushu Inst. Technology)
4th Author's Name Takashi Yasuda  
4th Author's Affiliation Kyushu Institute of Technology (Kyushu Inst. Technology)
5th Author's Name Akihiko Katsuki  
5th Author's Affiliation Kyushu Institute of Technology (Kyushu Inst. Technology)
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2006-06-30 15:50:00 
Presentation Time 25 minutes 
Registration for OME 
Paper # EMD2006-13, CPM2006-37, OME2006-47 
Volume (vol) vol.106 
Number (no) no.130(EMD), no.131(CPM), no.132(OME) 
Page pp.45-49 
#Pages
Date of Issue 2006-06-23 (EMD, CPM, OME) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan