Paper Abstract and Keywords |
Presentation |
2006-05-19 09:25
Heteroepitaxy of GaN for Si-GaN OEIC Tatsuya Kawano, Susumu Hatakenaka, Mikinori Itoh, Akihiro Wakahara, Hiroshi Okada, Makoto Ishida (Toyohashi Univ. Tech.) Link to ES Tech. Rep. Archives: ED2006-30 CPM2006-17 SDM2006-30 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
A novel Si/GaN/g-Al2O3/Si structure by which both Si-LSI(Large scale integrated circuit) and GaN-based optical devices can fabricate with post-growth processes was proposed and tried to realize. g-Al2O3 epitaxial layer used as both epitaxial template for GaN growth and etch stop layer for device process. GaN epitaxial layer was grown by OMVPE(Organometallic vapor phase epitaxy) and Si top layer was fabricated by using wafer bonding technique. In order to obtain GaN layer with flat surface and good crystalline quality, two-step growth, in which low V/III ratio was used in initial stage to enhance three dimension growth, then high V/III ratio to obtain flat surface was effective. Secondly, wefer-bonding conditions for GaN and Si were investigated. Low temperature grown GaN on Si was effective to avoid Si surface nitridation during the boding process and enhance the mass-transport process. Si/GaN/g-Al2O3/Si structure was realized by using these techniques. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
OEICs / OMVPE / g-Al2O3 / wafer-bonding / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 106, no. 46, CPM2006-17, pp. 55-60, May 2006. |
Paper # |
CPM2006-17 |
Date of Issue |
2006-05-11 (ED, CPM, SDM) |
ISSN |
Print edition: ISSN 0913-5685 |
Copyright and reproduction |
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Link to ES Tech. Rep. Archives: ED2006-30 CPM2006-17 SDM2006-30 |
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