IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2006-01-20 16:15
Analytical and experimental examinations of temeprature distribution of λ/4 type wave absorber using resistive film under high power injection
Shinya Watanabe, Kota Saito, Akitoshi Taniguti, Osamu Hashimoto (AGU), Toshifumi Saito (TDK) Link to ES Tech. Rep. Archives: ED2005-222 MW2005-176
Abstract (in Japanese) (See Japanese page) 
(in English) In this reserch, first, FDTD, Semi-Implicit Method
for Pressure Linked Equations (SIMPLE), Monte Calro and
Radiative Energy Absorption Distribution (READ) methods are
combined to calculate electromagnetic field and all the heat
transfer phenomena of heat transport, heat transfer by air
convection and heat radiation (It is called FDTD-SIMPLE-MR
method.). The temperature distribution of λ/4 type EM-absorber
using resistive film under high power injection is calculated using
FDTD-SIMPLE-MR method. Next, the high power injection
experiment is examined using the absorber and high power RF
instruments to get the temperature distribution experimentally.
Finally, the calculated and measured temperature distributions of
the absorber are compared and discussed.
As a result, the calculated temperature distribution of the
absorber by FDTD-SIMPLE-MR method agrees well with the
measured one. And the validity of FDTD-SIMPLE-MR method
is confirmed.
Keyword (in Japanese) (See Japanese page) 
(in English) FDTD Method / SIMPLE Method / Monte Carlo Method / READ Method / Heat Transport / Heat Transfer / Heat Radiation / EM-Absorber  
Reference Info. IEICE Tech. Rep., vol. 105, no. 525, MW2005-176, pp. 75-80, Jan. 2006.
Paper # MW2005-176 
Date of Issue 2006-01-13 (ED, MW) 
ISSN Print edition: ISSN 0913-5685
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF Link to ES Tech. Rep. Archives: ED2005-222 MW2005-176

Conference Information
Committee ED MW  
Conference Date 2006-01-18 - 2006-01-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Compound Semiconductor IC and High-Speed, High-Frequency Devices 
Paper Information
Registration To MW 
Conference Code 2006-01-ED-MW 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Analytical and experimental examinations of temeprature distribution of λ/4 type wave absorber using resistive film under high power injection 
Sub Title (in English)  
Keyword(1) FDTD Method  
Keyword(2) SIMPLE Method  
Keyword(3) Monte Carlo Method  
Keyword(4) READ Method  
Keyword(5) Heat Transport  
Keyword(6) Heat Transfer  
Keyword(7) Heat Radiation  
Keyword(8) EM-Absorber  
1st Author's Name Shinya Watanabe  
1st Author's Affiliation Aoyama Gakuin University (AGU)
2nd Author's Name Kota Saito  
2nd Author's Affiliation Aoyama Gakuin University (AGU)
3rd Author's Name Akitoshi Taniguti  
3rd Author's Affiliation Aoyama Gakuin University (AGU)
4th Author's Name Osamu Hashimoto  
4th Author's Affiliation Aoyama Gakuin University (AGU)
5th Author's Name Toshifumi Saito  
5th Author's Affiliation TDK Corp. (TDK)
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-3 
Date Time 2006-01-20 16:15:00 
Presentation Time 25 minutes 
Registration for MW 
Paper # ED2005-222, MW2005-176 
Volume (vol) vol.105 
Number (no) no.522(ED), no.525(MW) 
Page pp.75-80 
#Pages
Date of Issue 2006-01-13 (ED, MW) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan