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Paper Abstract and Keywords
Presentation 2006-01-18 13:30
A Low-Phase-Noise 76-GHz Planar Gunn VCO Using Flip-Chip Bonding Technology
Takashi Yoshida, Yoshimichi Fukasawa, Tadayoshi Deguchi, Kiyoshi Kawaguchi, Takahiro Sugiyama, Atsushi Nakagawa (New Japan Radio) Link to ES Tech. Rep. Archives: ED2005-192 MW2005-146
Abstract (in Japanese) (See Japanese page) 
(in English) A low-phase-noise76-GHz planar Gunn VCO using flip-chip bonding technology has been developed. The power consumption is 1.9 W at a bias voltage of 3.3 V. The measured output power is 13.5 dBm at 76.4 GHz, with a DC-RF conversion efficiency of 1.2%. The Gunn oscillator achieves a significantly low phase noise of -107 dBc/Hz at a 1-MHz offset frequency, because of its fundamental-mode operation. To our knowledge, this is the lowest reported phase noise in this frequency range. A tuning range of 210 MHz is obtained at a center frequency of 76.5 GHz in the tuning voltage range from 0 to 10 V. The output power averages 13.9 dBm and exhibits variation of less than 0.8 dB. The device exhibits excellent modulation linearity of less than 2.4%. Overall, this Gunn VCO exhibits excellent phase-noise performance, high output power, and good modulation linearity. This device demonstrates sufficient RF performance for use in automotive radar systems. The adoption of flip-chip bonding technology is expected to enable low-cost mass production and good reproducibility.
Keyword (in Japanese) (See Japanese page) 
(in English) Flip-chip / Low-phase-noise / Gunn diode / VCO / Automotive radar / / /  
Reference Info. IEICE Tech. Rep., vol. 105, no. 520, ED2005-192, pp. 1-5, Jan. 2006.
Paper # ED2005-192 
Date of Issue 2006-01-11 (ED, MW) 
ISSN Print edition: ISSN 0913-5685
Copyright
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF Link to ES Tech. Rep. Archives: ED2005-192 MW2005-146

Conference Information
Committee ED MW  
Conference Date 2006-01-18 - 2006-01-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Compound Semiconductor IC and High-Speed, High-Frequency Devices 
Paper Information
Registration To ED 
Conference Code 2006-01-ED-MW 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Low-Phase-Noise 76-GHz Planar Gunn VCO Using Flip-Chip Bonding Technology 
Sub Title (in English)  
Keyword(1) Flip-chip  
Keyword(2) Low-phase-noise  
Keyword(3) Gunn diode  
Keyword(4) VCO  
Keyword(5) Automotive radar  
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1st Author's Name Takashi Yoshida  
1st Author's Affiliation New Japan Radio Co., Ltd. (New Japan Radio)
2nd Author's Name Yoshimichi Fukasawa  
2nd Author's Affiliation New Japan Radio Co., Ltd. (New Japan Radio)
3rd Author's Name Tadayoshi Deguchi  
3rd Author's Affiliation New Japan Radio Co., Ltd. (New Japan Radio)
4th Author's Name Kiyoshi Kawaguchi  
4th Author's Affiliation New Japan Radio Co., Ltd. (New Japan Radio)
5th Author's Name Takahiro Sugiyama  
5th Author's Affiliation New Japan Radio Co., Ltd. (New Japan Radio)
6th Author's Name Atsushi Nakagawa  
6th Author's Affiliation New Japan Radio Co., Ltd. (New Japan Radio)
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Speaker Author-1 
Date Time 2006-01-18 13:30:00 
Presentation Time 25 minutes 
Registration for ED 
Paper # ED2005-192, MW2005-146 
Volume (vol) vol.105 
Number (no) no.520(ED), no.523(MW) 
Page pp.1-5 
#Pages
Date of Issue 2006-01-11 (ED, MW) 


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