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| Presentation | 2005-10-21 09:40 Thermal Analysis on Microprocessors Naoyuki Hasegawa, Mutsuo Ito, Ryusuke Egawa, Kenichi Suzuki, Tadao Nakamura (Tohoku Univ.) Link to ES Tech. Rep. Archives:  ICD2005-136 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Recently, the advance in the semiconductor process technology and the modern microarchitectural techniques have enabled microprocessors to obtain higher performance continuously. However, as a result of the radical improvement, in turn, inevitable high temperature induced by the circuits restricts the performance and reliability. Consequently, it is very important to analyze on-chip temperature distribution and apply the results of it to the design. Conventionally, most of the existing thermal analyzing methods regard a functional block as a heat source due to focusing on early design stages. It has a difficulty in comprehending and making use of the thermal behavior on later design stages. In our study, we propose a fine-grain thermal analysis method modeling a logic gate as a unit of a heat source. This paper shows quantitative evaluations of the effect of the fine-grain heat source model, and discusses the effectiveness of our proposal. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Thermal Analysis / Cell Level / Hotspot / / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 105, no. 352, ICD2005-136, pp. 13-18, Oct. 2005. | |
| Paper # | ICD2005-136 | |
| Date of Issue | 2005-10-14 (SIP, ICD, IE) | |
| ISSN | Print edition: ISSN 0913-5685 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | Link to ES Tech. Rep. Archives: ICD2005-136 |
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| Conference Information | |
| Committee | SIP ICD IE IPSJ-SLDM |
| Conference Date | 2005-10-20 - 2005-10-21 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Ichinobo, Sakunami-Spa |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Processor, DSP, Image Engineering and etc. |
| Paper Information | |
| Registration To | ICD |
| Conference Code | 2005-10-SIP-ICD-IE-IPSJ-SLDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Thermal Analysis on Microprocessors |
| Sub Title (in English) | |
| Keyword(1) | Thermal Analysis |
| Keyword(2) | Cell Level |
| Keyword(3) | Hotspot |
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| 1st Author's Name | Naoyuki Hasegawa |
| 1st Author's Affiliation | Tohoku University (Tohoku Univ.) |
| 2nd Author's Name | Mutsuo Ito |
| 2nd Author's Affiliation | Tohoku University (Tohoku Univ.) |
| 3rd Author's Name | Ryusuke Egawa |
| 3rd Author's Affiliation | Tohoku University (Tohoku Univ.) |
| 4th Author's Name | Kenichi Suzuki |
| 4th Author's Affiliation | Tohoku University (Tohoku Univ.) |
| 5th Author's Name | Tadao Nakamura |
| 5th Author's Affiliation | Tohoku University (Tohoku Univ.) |
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| Speaker | Author-1 |
| Date Time | 2005-10-21 09:40:00 |
| Presentation Time | 20 minutes |
| Registration for | ICD |
| Paper # | SIP2005-117, ICD2005-136, IE2005-81 |
| Volume (vol) | vol.105 |
| Number (no) | no.350(SIP), no.352(ICD), no.354(IE) |
| Page | pp.13-18 |
| #Pages | 6 |
| Date of Issue | 2005-10-14 (SIP, ICD, IE) |
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